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We specialize in Conference Management for Technology and Electronics
New Equipment | Assembly Services
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
New Equipment | Industrial Automation
face mask making machine For disposable nonwoven face mask body making.Every minute can output 80-100 pieces of mask body. Normally work together with face mask earloop welding machine, face mask tie on machine, from non woven raw material to co
Electronics Forum | Mon Sep 30 16:16:17 EDT 2019 | stephendo
We use "Uline N95 Deluxe Industrial Respirator" face masks. We are looking for something better. Our conformal coating machine has an active exhaust pulling fumes out and the door is closed when the machine is running. We have a fume hood with an act
Electronics Forum | Tue Oct 01 08:35:03 EDT 2019 | robl
For brush and dip coating we are using professional fume cabinets - https://monmouthscientific.co.uk/products/fume-cupboards/ 1.8m sized.
Used SMT Equipment | AOI / Automated Optical Inspection
BF - TRISTAR II Descriptif complet :La nouvelle machine automatique d'inspection optique en ligne SAKI BF-TRISTAR 2, permet de réaliser une inspection des deux faces d'une carte en simultanée , équipée de deux blocs d'inspection TOP et BOTTOM de
Used SMT Equipment | Soldering - Reflow
Electrovert Infraflo 500C - Reflow Oven -Ten (5 upper, 5 lower) panel type metal face heaters -PID control -Surface mounted thermocouples for quick response -Stainless steel construction of heating chamber -Edge heaters to fine tune temperature
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Industry News | 2009-01-13 19:55:39.0
OXFORD, CT � January 2009 � MIRTEC Corp., the AOI market leader in North America, reports strong growth in sales revenue for its North American Sales and Service Division.
Parts & Supplies | SMT Equipment
yamaha ys12 303 nozzle Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 Face book: alice@ksunsmt.com
Parts & Supplies | Pick and Place/Feeders
Samsung SAMSUNG SM Tray Feeder Specs: SAMSUNG SM Tray Feeder Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 Face book: alice@ksunsmt.com
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
Link:https://www.ascen.ltd/Products/mask_making_machine/ Automatic medical face mask making production machine to produce the finished face mask ,and to weld face mask by ultrasonic .From material feeding for produce face mask blank to welding the ea
Link:https://www.ascen.ltd/Products/mask_making_machine/ Automatic medical face mask making production machine to produce the finished face mask ,and to weld face mask by ultrasonic .From material feeding for produce face mask blank to welding the ea
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Jan 29 00:00:00 EST 2024 - Thu Feb 01 00:00:00 EST 2024 | Big Island, Hawaii USA
Pan Pacific Strategic Electronics Symposium
Events Calendar | Tue Mar 28 00:00:00 EDT 2017 - Thu Mar 30 00:00:00 EDT 2017 | Penang, Malaysia
South East Asia Technical Conference on Electronics Assembly
Career Center | bargain face-to-face, California USA | Engineering,Maintenance,Sales/Marketing,Technical Support
I.C.T Global Localization Recruitment | Join Our Team Today! We are actively seeking talented individuals from around the world to join our team. Take a look at the following positions available: 1. Senior SMT Engineer: 3 people 2. SMT Service E
Career Center | Austin, Texas USA | Engineering
Responsible for representing multiple factories worldwide with on-site, real-time consultation to customer design team on product design for manufacturability (DFM). This is accomplished by monitoring the customer design process through real-time des
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0299-pbga-die-face-delaminations
PBGA DIE FACE DELAMINATIONS ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● D9650 ● D9650Z PRODUCTION ● FastLine P300 ● Facts2 DF2400
| https://www.feedersupplier.com/sale-14499068-pro-face-3580205-digital-display-ast3201-a1-d24-pfxst3201aad.html
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