New SMT Equipment: fail 47 (218)

SC-300 Swirl Coat Applicator

SC-300 Swirl Coat Applicator

New Equipment | Coating Equipment

The SC-300 Swirl Coat® applicator offers three modes of operation - bead, monofilament and swirl. Ideal for conformal coating applications, the SC-300 handles a wide range of materials, varying in viscosity from 30 to 3500 mPa-sec (30 to 3500 centipo

Nordson ASYMTEK

Honeywell	10313/1/1 5 Vdc & watchdog distribution module

Honeywell 10313/1/1 5 Vdc & watchdog distribution module

New Equipment | Industrial Automation

Product Details: Brand Name: Honeywell Place of origin: United States Below Brands have Special Discout recently!! 1) TRICONEX(3008,3625,3805E.3721,3700A 4351B...) 2) BENTLY NEVADA(3500/42M ,3500/22M,3500/95.3500/05...) 3) HIMA(F3330,F323

Cambia Automation Limited

Electronics Forum: fail 47 (46)

BTU link fail

Electronics Forum | Mon Sep 19 04:27:47 EDT 2005 | dougs

Check your power supplies, we had same fail a while back on VIP98 faulty power supply was the cause

Can dye and pry test reveal which solder joints fail first?

Electronics Forum | Mon Jul 07 09:47:50 EDT 2008 | davef

Dye & pry test reveals the solder connections that have failed prior to performimng the test.

Used SMT Equipment: fail 47 (2)

Agilent 8753ES-011

Agilent 8753ES-011

Used SMT Equipment | In-Circuit Testers

Agilent 8753ES-011 Vector Network Analyzer Agilent 8753ES 30 Khz to 3 or 6 Ghz Vector Network Analyzer Includes - Calibration Certificate The Agilent 8753ES vector network analyzer allows complete characterization of RF components. The 8753ES

Test Equipment Connection

Agilent 8753ES-006-011

Agilent 8753ES-006-011

Used SMT Equipment | In-Circuit Testers

Agilent-Keysight 8753ES-006-011 Base Frequency: 30 KHz Max Frequency: 3 GHz Agilent 8753ES 30 Khz to 3 or 6 Ghz Vector Network Analyzer The Agilent 8753ES vector network analyzer allows complete characterization of RF components. The 8753ES inc

Test Equipment Connection

Industry News: fail 47 (6)

Paul Nickelsberg, President of Orchid Technologies featured in MassDevice Journal

Industry News | 2009-06-05 07:47:18.0

Paul Nickelsberg, spoke at MDG Forum: Why medical devices fail and what you need to do to prevent it from happening

Orchid Technologies Engineering & Consulting, Inc.

Smart Sonic to introduce Multi-tech Ultrasonic Stencil Cleaner at APEX 2007

Industry News | 2007-02-05 13:03:47.0

Multi-tech Stencil Cleaner provides ultimate chemistry flexibility

Smart Sonic Stencil Cleaning Systems

Technical Library: fail 47 (74)

Reliability of Reworked QFNs

Technical Library | 2014-09-11 11:43:48.0

In this DOD study the reliability of reworked QFNs is studied with the outcome being that a stay in place stencil does not impact the reliability of a QFN reworked using this technique

BEST Inc.

Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias

Technical Library | 2016-11-30 15:53:15.0

The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.

Raytheon

Express Newsletter: fail 47 (52)

Partner Websites: fail 47 (60)

Gluing - Liquid Adhesive - Nordson EFD

Nordson ASYMTEK | https://www.nordson.com/en/divisions/efd/applications/gluing-liquid-adhesive

form of dots, beads, and lines. Portable Dispensers Nordson EFD’s line of portable fluid dispensers is easy to use and offer durable, fail-safe construction with less hand fatigue

Nordson ASYMTEK

LED Reflow Oven Conditions and Temperature Time Control-News-Reflow oven,SMT Reflow Soldering Oven-c

| http://etasmt.com/te_news_bulletin/2020-10-08/19761.chtml

Conditions and Temperature Time Control From:    Author:LED Reflow Oven    Publish time:2020-10-08 17:47    Clicks:22 LED Reflow Oven Conditions and Temperature Time Control   SMT smart factory  I.C.T


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