Electronics Forum | Thu Oct 26 03:20:13 EDT 2000 | heccles
What would be a typical thermal test regime to verify the quality of solder joints for high specification applications - what would be the specific benefits of utilizing a "HALT" process over other traditional test techniques ?
Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc
I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to
Electronics Forum | Sat Nov 25 03:51:04 EST 2000 | carsonho
HALT is an approach to stimulate a failure till its existence. It is mainly used during product design and development phase. Traditional tests are mainly used to prove "no" failure but HALT is to make failure for information to improve in design of
Electronics Forum | Thu Feb 02 10:10:20 EST 2023 | tommy_magyar
Perhaps google this, as you will find very interesting articles. For scientific explanation look up solder fatigue on Wikipedia with references added. A more in depth explanation you can find on the Digikey forum where you will find other people like
Electronics Forum | Thu Feb 02 09:07:28 EST 2023 | charles_nguyen
Two types of land patterns used for surface mount pads are non-solder mask defined or NSMD pads and solder mask defined or SMD pads.Each type has its own advantages and disadvantages. There is a statement that SMD pad type may introduce stress concen
Electronics Forum | Mon Feb 06 17:58:16 EST 2023 | davef
The September 29, 2022 Express Newsletter [ https://smtnet.com/express/index.cfm?fuseaction=archives&issue=20220929 ] has papers on chip cracking
Electronics Forum | Wed Feb 08 09:43:08 EST 2023 | charles_nguyen
Thank you for the above information but what I want to talk about is the PCB design aspect. Should there be any warning about it in the DFM?
Electronics Forum | Fri Feb 17 19:23:05 EST 2023 | SMTA-64387083
Read the articles everyone else recommend. I haven't read of them but I will say this. A Solder Mask Defined pad is a copper flood that has much more thermal mass than a Non-Solder Mask Defined pad so it will heat and cool at a slower rate. I suspect
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Electronics Forum | Tue Jun 06 15:01:10 EDT 2000 | Charles Harper
The homologous point is the temperature midway betweeen the melting temperature (of the solder) and absolute zero. Below this point the solders are harder, stronger, and more resistant to fatigue. As solders are exposed to higher temperatures above
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