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Wedge Bonding Tool Selection

Technical Library | 2019-05-23 10:30:22.0

Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.

ACI Technologies, Inc.

Original Panasonic SMT Spare Parts 104691107604 NSC CHUCK 10469S0007

Technical Library | 2022-10-31 08:25:43.0

Material: Iron Model Name: NSC CHUCK Top Quality: 180g Automatic / Manual: Automatic Specification: Original New,copy New Shipping Method: FedEx, DHL, Etc.

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Yamaha Mounter Accessories 6604098 Class I Laser Product CyberOptics Unit Laser

Technical Library | 2022-10-31 09:01:25.0

Delivery Time: 1-2 Days Attributes: Original New Material: Metal Shipping Ways: DHL, FedEx, TNT, UPS, By Sea,DDP Dedicated Line Color: Black Certification: ISO

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

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