Technical Library: fielding (Page 1 of 6)

Component Failure Analysis - Hermetic Packaging

Technical Library | 2019-06-11 09:34:37.0

Recently ACI Technologies was asked to perform failure analysis on a hermetically sealed transistor for potential electrostatic discharge (ESD) or electrostatic overstress (EOS). ACI was asked to determine if the field-failed transistor was damaged by ESD or EOS. In order to properly assess the failure, additional samples were requested.

ACI Technologies, Inc.

The Power Packaging Laboratory at ACI Technologies

Technical Library | 2019-05-31 14:21:59.0

Microelectronics is the manufacture of systems built from extremely small electronic components. In today’s electronic world, devices must be portable, equipped with wireless technology and are driven by size, weight, power, and cost (SWaP-C). These system level drivers are crucial to all current and future electronic applications from personal computers and cellular telephones to military-fielded hardware, biomedical instrumentation, and space-flight hardware.

ACI Technologies, Inc.

Conformal Coating Inspection

Technical Library | 2019-05-21 17:31:39.0

In the field of electronics manufacturing, the end use of the product will always dictate the processes, procedures, and methods, not only for building the product, but also for testing, cleaning, and protecting the assembly in order to assure the level of quality required for proper operation. The need to protect an electronic assembly from its end use environment may stem from anyone of a number of hazardous (or potentially hazardous) conditions. Choosing the type of protective material is dependent upon matching that material’s characteristics with the conditions to be overcome. Naturally, the use of a protective (conformal) coating will require some method of verification to ensure the desired level and type of protection is achieved.

ACI Technologies, Inc.

Corrosion Analysis

Technical Library | 2019-06-03 15:32:40.0

ACI Technologies was pleased to assist a customer by conducting elemental analysis on several assemblies displaying severe corrosion. Several board assemblies had failed in the field and exhibited areas of corrosion in close proximity to onboard components. The most common source of corrosion on electronic assemblies is residual flux. Fluxes are specific chemistries applied during the soldering process which improve the wetting of the solder to both the pad and component when forming the solder joint. They can be highly reactive chemicals that, if left on the assemblies, can lead to corrosion, electrical degradation, and decreased reliability. In the presence of moisture and electrical bias, flux residue can enable dendritic growth as a result of electrochemical migration (ECM).

ACI Technologies, Inc.

Identifying Flux Residues

Technical Library | 2019-05-23 10:42:00.0

Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.

ACI Technologies, Inc.

Zirconia ceramic PCB, for applications in the field of microwave communication

Technical Library | 2023-05-10 01:42:46.0

Zirconia ceramic PCB, for applications in the field of microwave communication

Folysky Technology(Wuhan)Co.,Ltd

The prerequisites for tomorrow's technologies

Technical Library | 2019-05-29 16:04:52.0

Scheugenpflug focuses on e-mobility and autonomous driving and, with its high-quality dispensing solutions, is accompanying an imminent turn of events in the growth field of mobility.

Scheugenpflug Inc.

Conductive Anodic Filament (CAF) Formation: A Potential Reliability Problem for Fine-Line Circuits

Technical Library | 2023-03-16 18:57:32.0

Outline * Introduction & Background * Factors Affecting CAF Formation * CAF Formation ** Catastrophic Field Failure of Military Hardware ** Laboratory Experiments * Conclusion

Georgia Institute of Technology

The Environmental Cost of Green

Technical Library | 2009-09-30 23:12:29.0

Being involved in the electronics assembly industry for more than 23 years, specifically in the field of defluxing and cleanliness testing, I have seen my share of environmental regulations. Long before the debate over lead-free alloys, there was the Montreal Protocol.

Aqueous Technologies Corporation

Carrier tape introduction and classification

Technical Library | 2019-07-27 07:13:16.0

Carrier Tape refers to a strip product used in the field of electronic packaging, which has a specific thickness, and equidistantly distributes holes (also called pockets) for holding electronic components in the longitudinal direction thereof. Positioning hole for index positioning.

Shenzhen Sewate Technology Co.,Ltd

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