Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH
1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Fri Apr 15 13:25:40 EDT 2011 | tsvetan
agree, if you have fine pitch components the placement rate will be much less of what you see in the catalogues as they quote 0805 components placemen rate. I have one year log for one of our machine which is quoted to be 6400 cps and for one year a
Electronics Forum | Tue May 06 11:56:56 EDT 2008 | joeherz
We have a board that uses 0402x4 RNET packages that we are having a difficult time getting to solder consistently. Paste deposition is fine (using AIM WS353) and profile is dead-nuts. I'm starting to wonder if this is something that we're just goin
Electronics Forum | Wed Aug 13 05:18:40 EDT 2008 | lococost
that's a pretty cool idea, I like some thinking 'outside the box '! 1. I don't think picking it up and placing it will be much of a problem. once the rivet is placed it will be held in place by the paste. However, you would need to make a tray that
Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal
Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process
Electronics Forum | Sun Dec 19 17:45:35 EST 1999 | Bill Petlock
Clarissa, Buying used equipment should not be risky if you do your homework. As M COX said, you should find out if the manufacturer still supports the machinery but don't take everything they tell you as gospel. Remember, they want to sell you a new
Electronics Forum | Fri Jan 16 16:57:14 EST 2015 | dilogic
I doubt you will be able to get satisfactory results with 0201. 0402 is another story. When doing 0402 projects, we use only electric (MP) feeders and always at the same feeder slots (feeder teach done for each of them). MPF08 nozzle works fine. Also
