Industry Directory: fine pitch flip chip (16)

PFC Flexible Circuits Limited

Industry Directory | Manufacturer of Components / Manufacturer of Bare PCBs / Manufacturer of Assembled PCBs / Design / Contract Manufacturer

PFC Flexible Circuits Limited designs, manufactures, and assembles flexible circuits; single-sided, double-sided, multilayer and rigid flex. We are ISO 9001 and 13485 approved.

KSW Microtec

Industry Directory | Service Provider

Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)

New SMT Equipment: fine pitch flip chip (136)

Spectrum II S2-900 Series Fluid Dispensers

Spectrum II S2-900 Series Fluid Dispensers

New Equipment | Dispensing

Scalable Fluid Dispensers for Assembly of Semiconductors, MEMS, Storage Devices, and PCBs. High Speed, High Accuracy, Precision Dispensing System. The Spectrum II Series is the next evolution of the widely successful Spectrum fluid dispensers from

Nordson ASYMTEK

1.2m LED light bar special semi-automatic solder paste printing machine S1200

1.2m LED light bar special semi-automatic solder paste printing machine S1200

New Equipment |  

technical parameter Model: s1200 (special type for LED light bar) Overall dimension (L × w × h): 1650 × 620 × 1550 (mm) Platform size: 320 × 1300 (mm) PCB size: 250 × 1250 (mm) Applicable template size: 550 ×

KingFei SMT Tech

Electronics Forum: fine pitch flip chip (205)

flip chip tolerances

Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont

I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?

Re: Flip chip placer

Electronics Forum | Mon Mar 09 15:53:05 EST 1998 | Tom Foley

| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. Take a close look at the Philips ACM. The ACM is engineere

Used SMT Equipment: fine pitch flip chip (40)

Samsung SM-421 Chip Mounter

Samsung SM-421 Chip Mounter

Used SMT Equipment | Chipshooters / Chip Mounters

Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with

Shenzhen ETA Technology Co., Ltd

Assembleon Emerald  with LCS

Assembleon Emerald with LCS

Used SMT Equipment | Pick and Place/Feeders

The Emerald-X is a fine pitch placer that can handle a wide range of components at speeds up to 4,000 QFPs per hour. The machine is built around a very rigid, vibration-free frame for improved accuracy and long-term stability and is perfectly suit

World Equipment Source / R1 Source, Inc.

Industry News: fine pitch flip chip (202)

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West

Industry News | 2014-06-22 19:12:37.0

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.

MIRTEC Corp

Nordson ASYMTEK Introduces Continuous Path Motion Control Software

Industry News | 2013-08-20 23:02:16.0

Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.

Nordson ASYMTEK

Parts & Supplies: fine pitch flip chip (5)

Yamaha Which series nozzles could be used for Phlips Topaz and Emerald machine

Yamaha Which series nozzles could be used for Phlips Topaz and Emerald machine

Parts & Supplies | Pick and Place/Feeders

Which series nozzles could be used for Phlips Topaz and Emerald machine As we know, many parts are compatible for Yamaha and Philips machines, but some models their nozzles are not generic.So which series nozzles could be used for Phlips Topaz and

ZK Electronic Technology Co., Limited

Samsung Samsung Mounter CP60 Servo IF Board J9060235A [CP60HP-SERVO IF BOARD ASSY

Samsung Samsung Mounter CP60 Servo IF Board J9060235A [CP60HP-SERVO IF BOARD ASSY

Parts & Supplies | Assembly Accessories

Samsung Mounter CP60 Servo IF Board J9060235A [CP60HP-SERVO IF BOARD ASSY Samsung Mounter CP60 Servo IF Board J9060235A [CP60HP-SERVO IF BOARD ASSY Email:smtdwx@gmail.com Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009 过滤芯 1. 原厂全新SAMSUNG

CNSMT CO.LTD

Technical Library: fine pitch flip chip (10)

Process Development And Characterization Of The Stencil Printing Process For Small Apertures

Technical Library | 2008-01-16 18:25:55.0

The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.

Speedline Technologies, Inc.

Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package

Technical Library | 2018-01-17 22:47:02.0

Fine pitch copper (Cu) Pillar bump has been growing adoption in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities, thus assembling such packages using a standard mass reflow (MR) process and maintaining its performance is a real and serious challenge. (...) In this study a comprehensive finding on the assembly challenges, package design, and reliability data will be published. Originally published in the SMTA International 2016

STATS ChipPAC Inc

Videos: fine pitch flip chip (14)

Assembleon Opal XII Demonstration

Assembleon Opal XII Demonstration

Videos

FOR SALE: Assembleon / Yamaha Opal XII smt pick and place pcb assembly machine running production. This machine is available fully functional from the Capital Equipment Exchange. http://www.ce-exchange.com/detail/assembleon-opal-xii-flex-placer-48

Capital Equipment Exchange

Samsung Samsung CP45FV NEO SMT Placeme

Samsung Samsung CP45FV NEO SMT Placeme

Videos

Configuration ● nozzle changer ● fixed vision camera ● windows based s/w ● manuals & s/w included   Advanced Flying Vision System The Flying Vision System, developed by Samsung, utilizes separate cameras for each of the 6 heads. Standard pa

Capital Equipment Exchange

Training Courses: fine pitch flip chip (24)

IPC-7711/7721 Specialist (CIS) Recertification Course

Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.

The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.

Blackfox Training Institute, LLC

IPC-7711/7721 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: fine pitch flip chip (58)

Advanced Micro SMT Hand Soldering

Events Calendar | Mon May 16 11:00:00 EDT 2016 - Fri May 20 11:00:00 EDT 2016 | Seattle, Washington USA

Advanced Micro SMT Hand Soldering

EPTAC Corporation

Advanced Micro SMT Hand Soldering

Events Calendar | Mon Aug 01 11:00:00 EDT 2016 - Fri Aug 05 11:00:00 EDT 2016 | Seattle, Washington USA

Advanced Micro SMT Hand Soldering

EPTAC Corporation

Career Center - Resumes: fine pitch flip chip (15)

Sr. Manufacturing Engineer with over 20 yrs experience

Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production

Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Express Newsletter: fine pitch flip chip (457)

SMTnet Express - January 18, 2018

SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip

SMTnet Express - May 29, 2014

SMTnet Express, May 29, 2014, Subscribers: 22783, Members: Companies: 13874, Users: 36243 Microspring Characterization and Flip-Chip Assembly Reliability B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F

Partner Websites: fine pitch flip chip (156)

Inspection Mirrors & Milprobes

Beau Tech | https://www.beautech.com/newprod.cfm

: Distributors Our Mission Contact Us Proud Sponsor Of: 1 MilProbes for Ultra Fine Pitch Rework - BGA, Flip Chip, TAB, COB, etc. The RocHard 1 MilProbe is a

Beau Tech

techtips2Q2019_techtip5-2019

ACI Technologies, Inc. | https://www.aciusa.org/wp-content/uploads/2021/07/techtip5-2019.pdf

(bump size, pitch, and number of bumps). Some of the flip chip manufacturing processes along with their advantages and disadvantages will be discussed in this article

ACI Technologies, Inc.


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