Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
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The NeoDen third generation desktop pick and place machine TM245P is a model with completely independent intellectual property, which adopted the latest research and development of technology. Below are the new features of TM245P compare to the secon
Electronics Forum | Thu Jun 16 08:31:15 EDT 2005 | jh0n!
The most part I have the most difficulty with is a 16mil QFN. We found that reducing stencil thickness to 4mil, and reducing aperatures for the IC by 20%, and setting local fiducials to the IC helped immensely. We used to get 75% or more bridged ou
Electronics Forum | Wed Sep 04 22:48:13 EDT 2013 | winson16
SMT fine pitch connector having oxidation on lead and P&P machine keep rejecting the part. Is there any alternative way to reduce the part throw out rate without jeopardize the placement accuracy? Or is it possible to re-coat the connector lead or an
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2020-10-04 15:41:30.0
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.
Industry News | 2014-01-30 17:35:39.0
Manncorp has recently reconfigured and expanded its exclusive selection of SMT turnkey packages, including stencil printers, pick and place machines, and reflow ovens, to accommodate a wider range of production levels and budgets. Among the ten different turnkeys presented on their website at www.manncorp.com/turnkeys is the new 2500-MV package. Priced at only $46,995, the 2500-MV is designed for companies with a limited budget and minimal floor space who need short-run, in-house production capability for ultra-precise, high component-mix SMT assembly.
In the world of makers, people enjoy the fun of designing and developing hardware/ software, even final electronic products. They will not concentrate a lot on the cost and manufacturability. But it is quite different from lab to factory, when it com
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | Santa Cruz, California USA | Production,Quality Control
Soldering Technician, Touch-up for PCBAs Perform hand soldering and touch-up rework for Printed Circuit Board Assemblies (PCBA), cables and associated equipment. Inspect PCBA for defects, loose connections, missing components. Solder to perform r
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, April 20, 2017, Subscribers: 30,402, Companies: 10,575, Users: 23,153 High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing Tobias Sponholz, Lars-Eric Pribyl, Frank Brüning, Robin Taylor
Lewis & Clark | https://www.lewis-clark.com/product-category/pick-place/page/2/
HYDRA Fine Pitch Includes (2) 2014 Electro Design Rear Conveyors Condition: Complete & Operational – Extremely Low Usage Hours – Under 550 Location & Shipment: USA /FOB Origin Sold
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Nanomaterial Surface Finishes for Assembly of Printed Circuit Boards for High Reliability Applications Gregory Morose, et al. Abstract 22-4 ELECTROLESS Ni/Pd/Au PLATING FOR PACKAGE SUBSTRATES WITH FINE PITCH WIRING Yoshinori Ejiri, et al. Abstract 22-4 ACHIEVING
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