Shan Dong Finer Lifting Tools co.,LTD here! We are the manufacturer of follow lifting tools: spring balancer, roller skids, hydraulic toe jack, fluid caster, permanent magnetic lifter and so on material handling tools.
Solder powders are the key component of all solder pastes. Pastes made with the same flux but with powders that differ in particle sizes often have different rheological/physical properties resulting in differences in screen/stencil printing, compone
Air Casters also named air mover, air moving system, air moving skids, air load roller, air trailer, air dolly and so on names. Air Casters via compressed air as power source to move the equipment easily and safety, with no shake and steadily,
Electronics Forum | Wed Mar 15 21:52:33 EST 2000 | Chuck Garth
A long time ago I had seen wiping fixtures in which the circuit board was placed and fingers bent the leads on the components. Can anyone supply me with their design. I can almost see them work but am missing on the finer points
Electronics Forum | Wed Dec 15 09:18:00 EST 1999 | Chris May
Can people let me know what reductions are typical for stencils. This can obviously be affected by the technology of the board, but for chip caps and R's do you use 1:1 and only reduce for finer pitch stuff ? Your help would be appreciated. Regards
Tektronix MSO4104 Mixed Signal Oscilloscope Features & Benefits Key Performance Specs 1 GHz, 500 MHz, 350 MHz Bandwidth Models 2 or 4 Channel Digital Phosphor Oscilloscopes 16 Digital Channels (MSO4000) Suite of Advanced T
Industry News | 2018-11-06 20:29:38.0
ZESTRON is pleased to announce that Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present a case study entitled “Jet Printing Cleaning Challenges” at the IPC-SMTA High-Reliability Cleaning and Conformal Coating Conference in Schaumburg, IL.
Industry News | 2019-08-16 11:31:15.0
ZESTRON's Ravi Parthasarthy will be presenting, "Jet Printed Solder Paste and Cleaning Challenges" at the SMTA Capital Expo on August 22.
Technical Library | 2017-12-07 10:35:50.0
Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts, tin whiskers, and corrosion at the board level. Within conformal coatings different material chemistries specialize in shielding from an array of hazards and can be applied by multiple methods. The most common method is atomized spray which disperses the material into a fine mist. Alternatively, non-atomized coating controls the materials' dispense shape while maintaining the original liquid form. While some applications demand atomized spray and other scenarios overlap between atomized and non-atomized coating, this paper focuses on the circumstances where materials are ideally suited for non-atomized, selective coating.
Technical Library | 1999-05-09 12:51:38.0
This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices.
Please join ZESTRON Academy for a comprehensive overview of pH neutral cleaning agent development coupled with performance reviews of pH neutral cleaning agents. Given the greater use of lead-free solder paste and the required higher reflow profiles,
Events Calendar | Thu May 28 00:00:00 EDT 2020 - Thu May 28 00:00:00 EDT 2020 | ,
Cleaning with pH Neutral Chemistry - Background, Applications, and Benefits
., which will display the system at NPE2015 (Booth W6263). The new water filtration system also has a finer filter mesh—150 µm versus the 200 µm capability of the standard system available with Master-Line pelletizers
: Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume. The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces