Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2020-04-14 15:49:38.0
The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly.
Technical Library | 2019-06-17 15:09:43.0
Very often pick and place machines are programmed using CAD data. This data increases the accuracy, precision, and repeatability of its component placement objectives. CAD data makes fine pitch and small component assemblies repeatable, but cannot adjust to a particular board unless it is exactly the same size and shape of the original board used for programming. The process by which printed circuit boards (PCBs) are made only allows some minor changes inboard size and shape, but these small differences are enough for parts to be misplaced. For this reason we use fiducial marks to increase the chances of precise component alignment.
Technical Library | 2017-12-07 10:35:50.0
Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts, tin whiskers, and corrosion at the board level. Within conformal coatings different material chemistries specialize in shielding from an array of hazards and can be applied by multiple methods. The most common method is atomized spray which disperses the material into a fine mist. Alternatively, non-atomized coating controls the materials' dispense shape while maintaining the original liquid form. While some applications demand atomized spray and other scenarios overlap between atomized and non-atomized coating, this paper focuses on the circumstances where materials are ideally suited for non-atomized, selective coating.
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2019-05-29 10:38:59.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2020-12-07 15:26:06.0
Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Technical Library | 2023-11-20 09:56:38.0
Understanding The Crucial Role Of Dust Collectors In PCB Depaneling Machines Precision is paramount in PCB manufacturing, but it must go hand in hand with cleanliness. The intrusion of dust and debris can wreak havoc on delicate electronics. This article explores the pivotal role of dust collectors, their operation, and their necessity for various PCB depaneling machines. The Dust Collector's Crucial Function Dust collectors, also known as dust extractors, play an indispensable role in PCB manufacturing. When a PCB depaneling machine or a Laser PCB Depaneling machine is in operation, it generates a significant amount of dust. The dust collector promptly engages its vacuum motor to suction fine particles off the PCB, directing them to a collector equipped with a filtration system. Which Models Of PCB Depanelers Require Dust Collector? Several PCB depaneling machines necessitate dust collectors to ensure precision and cleanliness, including: I.C.T-5700 Offline Depaneling Machine, high precision, easy manual operation, dual platform, high efficiency. I.C.T-IR350 In-line depaneling machine, high precision, rapid operation, suitable for integration into the SMT production line for Industry 4.0 and AI automated production. I.C.T-LCO350 Laser cutting ensures cutting accuracy of 0.002, ideal for precise cutting requirements. I.C.T-100A Desktop PCB depaneling machine with compact size and high precision, suitable for smaller-scale operations. The Science Behind PCB Dust Collectors To prevent charged dust particles from adhering to PCBs, PCB depaneling machines are equipped with ionizing guns. These devices emit ions that neutralize static charges, making dust particles less likely to stick to freshly cut PCBs. The Vacuum Effect: Suctioning Away Dust During PCB depaneling, a cloud of dust is produced. The dust collector utilizes a robust suction system, often powered by vacuum motors, to draw dust away from the work area. Collected dust is transported to a designated collection point within the dust collector. A Difference In Design: I.C.T-5700 Vs. I.C.T-IR350 The placement of the dust collection apparatus distinguishes PCB depaneling machines. I.C.T-5700 has a bottom-mounted system capturing falling dust, while I.C.T-IR350 features a top-mounted system preventing dust settling on the work surface. This strategic difference ensures efficient removal of dust and debris, guaranteeing a clean and precise manufacturing process. Check: If you want to learn about the comparison of I.C.T-5700 and I.C.T-IR350. The Importance Of Filter Replacement The efficiency of a dust collector relies on its filter, necessitating periodic replacement every 1-3 years, depending on usage frequency. Regular filter maintenance ensures optimal performance. Dust Collectors: Keep Your PCB Manufacturing Clean And Precise Precision in PCB manufacturing is not solely about cutting-edge machinery but also about cleanliness. If you seek a dust collector for your PCB depaneling machine, contact us today to explore your options. Ensure your operations maintain cleanliness, efficiency, and meet the high standards of modern PCB manufacturing. Don't let dust compromise your precision – let's keep it clean together!
Technical Library | 2023-11-20 09:56:42.0
Understanding The Crucial Role Of Dust Collectors In PCB Depaneling Machines Precision is paramount in PCB manufacturing, but it must go hand in hand with cleanliness. The intrusion of dust and debris can wreak havoc on delicate electronics. This article explores the pivotal role of dust collectors, their operation, and their necessity for various PCB depaneling machines. The Dust Collector's Crucial Function Dust collectors, also known as dust extractors, play an indispensable role in PCB manufacturing. When a PCB depaneling machine or a Laser PCB Depaneling machine is in operation, it generates a significant amount of dust. The dust collector promptly engages its vacuum motor to suction fine particles off the PCB, directing them to a collector equipped with a filtration system. Which Models Of PCB Depanelers Require Dust Collector? Several PCB depaneling machines necessitate dust collectors to ensure precision and cleanliness, including: I.C.T-5700 Offline Depaneling Machine, high precision, easy manual operation, dual platform, high efficiency. I.C.T-IR350 In-line depaneling machine, high precision, rapid operation, suitable for integration into the SMT production line for Industry 4.0 and AI automated production. I.C.T-LCO350 Laser cutting ensures cutting accuracy of 0.002, ideal for precise cutting requirements. I.C.T-100A Desktop PCB depaneling machine with compact size and high precision, suitable for smaller-scale operations. The Science Behind PCB Dust Collectors To prevent charged dust particles from adhering to PCBs, PCB depaneling machines are equipped with ionizing guns. These devices emit ions that neutralize static charges, making dust particles less likely to stick to freshly cut PCBs. The Vacuum Effect: Suctioning Away Dust During PCB depaneling, a cloud of dust is produced. The dust collector utilizes a robust suction system, often powered by vacuum motors, to draw dust away from the work area. Collected dust is transported to a designated collection point within the dust collector. A Difference In Design: I.C.T-5700 Vs. I.C.T-IR350 The placement of the dust collection apparatus distinguishes PCB depaneling machines. I.C.T-5700 has a bottom-mounted system capturing falling dust, while I.C.T-IR350 features a top-mounted system preventing dust settling on the work surface. This strategic difference ensures efficient removal of dust and debris, guaranteeing a clean and precise manufacturing process. Check: If you want to learn about the comparison of I.C.T-5700 and I.C.T-IR350. The Importance Of Filter Replacement The efficiency of a dust collector relies on its filter, necessitating periodic replacement every 1-3 years, depending on usage frequency. Regular filter maintenance ensures optimal performance. Dust Collectors: Keep Your PCB Manufacturing Clean And Precise Precision in PCB manufacturing is not solely about cutting-edge machinery but also about cleanliness. If you seek a dust collector for your PCB depaneling machine, contact us today to explore your options. Ensure your operations maintain cleanliness, efficiency, and meet the high standards of modern PCB manufacturing. Don't let dust compromise your precision – let's keep it clean together!
.gif)
