Industry News | 2013-06-26 09:09:19.0
The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.
Industry News | 2011-07-22 23:48:37.0
DEK introduced two breakthrough technologies, ProActiv and Nano-ProTek stencil coating, to customers in Chengdu last week.
Industry News | 2015-09-23 16:38:42.0
Saki Corporation announces presentations of its true 3D automated optical inspection (AOI) and measurement equipment at the Surface Mount Technology International (SMTAI) Show, being held in Rosemont, IL on September 29-30, 2015 at booth #1025. Saki's BF-3Di AOI System doesn't just inspect, it provides measurement of each component for heights from 0 to 20mm, with 1-micron height resolution.
Industry News | 2019-01-22 12:41:53.0
Saki Corporation will present its 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) systems, plus new 2D Bottom-side AOI, at IPC APEX Expo 2019, January 29-31, at the San Diego Convention Center, San Diego, CA, at booth #1407. In addition, Saki's M2M communication/Industry 4.0/Smart Factory capabilities will be on display in the Fuji booth #1317 and in the Hermes/CFX production line.
Industry News | 2012-06-19 13:40:11.0
Surmotech’s product mix continues to shift towards highly complex, dense PCBAs and these customers have increasingly been calling for complete product, materials and process traceability. After investigating several alternative solutions to this requirement, Surmotech found Aegis’ MOS (manufacturing operations software) to be the best available choice.
Industry News | 2013-11-05 10:04:10.0
Marquardt GmbH of Rietheim-Weilheim (Germany)uses the Viscom S3088 SPI3D solder paste inspection system.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2019-04-16 19:50:51.0
Nepcon China, booth no. 1J20 At the upcoming Nepcon China show, Viscom will showcase their powerful range of full 3D AOI, 3D AXI and 3D SPI inspection systems highlighting cutting-edge smart factory integration and a new 3D AOI with unprecedented speed and versatility.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2013-02-21 09:34:56.0
Viscom AG, has developed a totally new camera module.
