Industry Directory: first pass (15)

Flex Interconnect Technologies

Flex Interconnect Technologies

Industry Directory | Manufacturer of Assembled PCBs / Assembly / Contract Manufacturer / Service Provider

Designer, manufacturer and assembler of quickturn protoype to high volume production of flex circuits, rigid-flex and HDI flex circuits

Okika Technologies

Okika Technologies

Industry Directory | Design / Service Provider

A Global Integrated Circuit (IC) Products and Electronics Design Services company specializing in signal conditioning problem solving through our software defined analog platform and custom ASIC design services.

New SMT Equipment: first pass (292)

Unisoft CELLS - Product Tracking MES Software

Unisoft CELLS - Product Tracking MES Software

New Equipment | Software

Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry. 

UNISOFT Corporation

Vitronics Soltec ZEVAv Selective Soldering Machine

Vitronics Soltec ZEVAv Selective Soldering Machine

New Equipment | Selective Soldering

ZEVAv selective soldering machine delivers the best value in the high-speed selective soldering market. The ZEVAv platform leverages proven, market-leading fluxing, preheating and soldering technology to meet the growing challenges of high yields, co

ITW EAE

Electronics Forum: first pass (328)

Typical first pass yield in electronics

Electronics Forum | Tue Apr 27 07:20:34 EDT 1999 | Richard Marks

I'm a mechanical engineer and we buy electronic pressure sensors and switches. In doing quality audits, I need to understand what "best practice" will yield in terms of conforming product first time through the manufacturing process? Any data out t

Re: Typical first pass yield in electronics

Electronics Forum | Tue Apr 27 09:31:45 EDT 1999 | Robert L. McCallum

On circuit board assemblies first pass yields need to be above 98%, if a supplier is below this level it is a indication that: he has poor control of the manufacturing process; Poor component selection (price over quality; excepted a poor design from

Used SMT Equipment: first pass (11)

Orbotech S36 LF

Orbotech S36 LF

Used SMT Equipment | AOI / Automated Optical Inspection

Description:  AOI Vintage:  2007 Details: • 100-230V- 50/60Hz/ 3.2KVA • Windows XP Operating System • Software Version: First pass 200.28 Condition:  Complete & Operational Location & Shipping:  LCI FL/ USA FOB Availability:  Immediate for pu

Lewis & Clark

Orbotech S36

Orbotech S36

Used SMT Equipment | AOI / Automated Optical Inspection

Hello and thank you for your interest in our Orbotech Symbion S36 AOI For Sale. The system is Year 2006.... Excellent condition !!! Complete with all accessories and manuals. Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI performan

1st Place Machinery Inc.

Industry News: first pass (276)

Europlacer Partners with New Age EMS in Attleboro, MA New Age EMS selects extensive capability with Europlacer IINEO-II platform

Industry News | 2012-09-04 09:33:37.0

Europlacer North America announces that it has successfully installed an IINEO-II, capable of handling 24 wide x 27" long boards, at New Age EMS of Attleboro, MA. The IINEO-II platform features 264 8 mm feeder slots and has a maximum placement rate of 27,300 cph. 

EUROPLACER

Europlacer Partners with PPI/Time Zero in New England and New Jersey.

Industry News | 2017-03-26 14:52:40.0

Europlacer Americas announces that is has successfully installed an IINEO-II placement platform at PPI/Time Zero of Fairfield New Jersey and an IICO placement platform plus Europlacer EP710 Screen Printer at PPI/Time Zero’s New England Facility. The New Jersey IINEO-II installation delivers extensive capability. The New England installation is a second line productivity solution.

EUROPLACER

Technical Library: first pass (268)

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization

Technical Library | 2017-12-07 10:35:50.0

Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts, tin whiskers, and corrosion at the board level. Within conformal coatings different material chemistries specialize in shielding from an array of hazards and can be applied by multiple methods. The most common method is atomized spray which disperses the material into a fine mist. Alternatively, non-atomized coating controls the materials' dispense shape while maintaining the original liquid form. While some applications demand atomized spray and other scenarios overlap between atomized and non-atomized coating, this paper focuses on the circumstances where materials are ideally suited for non-atomized, selective coating.

Nordson ASYMTEK

Videos: first pass (16)

Job Tracking MES software-Low cost Product and Job Tracking Manufacturing Execution System (MES).

Job Tracking MES software-Low cost Product and Job Tracking Manufacturing Execution System (MES).

Videos

www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor

UNISOFT Corporation

Vitronics Soltec ZEVAm Selective Soldering System

Vitronics Soltec ZEVAm Selective Soldering System

Videos

ZEVAv selective soldering machine delivers the best value in the high-speed selective soldering market. The ZEVAv platform leverages proven, market-leading fluxing, preheating and soldering technology to meet the growing challenges of high yields, co

ITW EAE

Training Courses: first pass (5)

IPC/WHMA-A-620 Specialist (CIS) Certification Training Course

Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)

The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.

Blackfox Training Institute, LLC

IPC/WHMA-A-620 Trainer (CIT) Certification Training Course

Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)

The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.

Blackfox Training Institute, LLC

Career Center - Resumes: first pass (28)

Bruce Barton August 2011

Career Center | Poplar Grove, Illinois | Engineering,Production,Quality Control,Technical Support

Please see resume.

Bruce L. Barton

Career Center | Poplar Grove, Illinois USA | Management,Production,Quality Control,Technical Support

20+ years in electronic manufacturing, sales support,customer support.

Express Newsletter: first pass (381)

Partner Websites: first pass (152)

ACI Technologies, Inc

| https://store.aciusa.org/courses/bga_insp-rwk-rep.pdf

ACI Technologies, Inc Overview Manufacturing with Ball Grid Array (BGA) packages generally offers high, first-pass process yields

Underfill Dispensing

GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php

. If all the material disappears and there is no fillet or meniscus at the sides of the die, then either: More material is required on the first fill pass, An additional fill pass is needed, OR A fillet pass is required

GPD Global


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