Partner Websites: first pass (Page 1 of 72)

S3X58-M650-7

| https://pcbasupplies.com/wp-content/uploads/2023/10/S3X58-M650-7-solder-paste.pdf

the testing probe to get the accurate readings thus improving the first pass yield. Solder joint is kept off from flux residue deposit, thus improving ICT testability

Gesicherte Qualität und handfeste wirtschaftliche Vorteile

| https://productronica.com/de/messe/presse/pressemitteilungen/detail/gesicherte-qualitaet-und-handfeste-wirtschaftliche-vorteile.html

, erläutert, warum KI in AOI-Anwendungen eine so große Rolle spielt: Bereits ohne KI ließen sich zwei Drittel der getesteten Baugruppen als Gutteil erkennen. Unter den ca. 30%, die den „first pass yield

Assured quality and tangible economic benefits

| https://productronica.com/en/trade-fair/press/press-releases/detail/assured-quality-and-tangible-economic-benefits.html

: Even without AI, two thirds of the tested assemblies could be identified as good parts. Of the around 30% not in the first pass yield, only the smallest portion actually had an error

Multi Function Vertical Buffer_Shenzhen Honreal Technology CO.,Ltd.

| http://www.szhonreal.com/productview.asp?id=22

; 3.Easy to operate LED touch screen control interface; 4.FIFO(first in first out),LIFO(last in first out)and pass through function optiona; 5

Prozess-Fehlerbehebung

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/select/soldering-processes/process-troubleshooting-guide

Lötqualität und der First-Pass-Ausbeute einer Leiterplattenbaugruppe sind eine Reihe von Verbesserungen am Prozess, der Baugruppe, der Fertigung und dem Design erforderlich. Daher

ASYMTEK Products | Nordson Electronics Solutions

Underfill Dispensing

GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php

. If all the material disappears and there is no fillet or meniscus at the sides of the die, then either: More material is required on the first fill pass, An additional fill pass is needed, OR A fillet pass is required

GPD Global

Underfill Dispensing

GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php

. If all the material disappears and there is no fillet or meniscus at the sides of the die, then either: More material is required on the first fill pass, An additional fill pass is needed, OR A fillet pass is required

GPD Global

Underfill Dispensing

GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php

. If all the material disappears and there is no fillet or meniscus at the sides of the die, then either: More material is required on the first fill pass, An additional fill pass is needed, OR A fillet pass is required

GPD Global

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