Electronics Forum: flake and 5,000-sc-200 (3)

Conductive Adhesives and flip chip

Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan

HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk

We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.

Express Newsletter: flake and 5,000-sc-200 (1)


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