JUKI Pick and Place Machine Applicable Components: 0201~5050 Board size:50×50-650×370mm Feeder inputs:max.112 placement capacity:47,000 CPH Product description: JUKI Pick and Place Machine: 0201~5050,Board size:50×50-650&time
Hitachi GXH-1S Pick and Place Machine Component range: 0201 ~ 44 * 44mm Four placement heads: 12 nozzles each 4-axis 4-head Accuracy: +/- 0.05mm, 8mm * 2mmpitch 0201 Product description: Hitachi GXH-1S Pick and Place Machine, Component range:
Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal
Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process
Electronics Forum | Mon Jul 20 17:04:44 EDT 1998 | Richard Jackson
Can someone point me to where I can get a copy of the spec for these finishes. Thanks Richard Jackson richardj@tanisys.com Jackson_Richard@csi.com
Industry News | 2003-07-08 09:09:15.0
Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz
Industry News | 2011-11-27 00:32:29.0
Data I/O Corporation has partnered with Aegis to deliver comprehensive solutions for end unit traceability, process tracking, and quality management.
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. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder