Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Industry News | 2015-10-21 17:15:18.0
Fancort Industries, Inc. will exhibit in Hall B2, Booth 389 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Fancort is a leader in the design and fabrication of lead forming and cutting equipment, primarily for SMDs and some through-hole applications. The company will showcase its wide selection of equipment and services designed to meet all requirements from prototype to moderate production, specializing in processing high-reliability aerospace grade devices to exacting SMT tolerances. Fancort will display its standard line of SMT products, including:
Industry News | 2012-02-03 13:29:38.0
Practical Components will feature its new Amkor PoP stacked packages, including the new TMV PoP, along with its full line of dummy component packages in Booth #538 at the upcoming IPC APEX Expo.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2018-11-27 14:03:14.0
Super PCB is pleased to announce that it offers a variety of quality PCB surface finishes. PCB surface finish is the coating between the PCB and components that provides a solderable surface for components and protects the exposed copper circuitry.
Industry News | 2022-01-10 16:39:30.0
Indium Corporation's Ron Lasky, Ph.D., PE, senior technologist, will share his industry knowledge and expertise during two presentations at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 31-Feb. 3, Honolulu, O'ahu, Hawaii, U.S.
