Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2016-11-14 11:44:29.0
Kester is proud to announce the launch of SF855-LR Soldering Flux, a low solid, low residue, no-clean non-rosin organic flux designed specifically for use in tabber and stringer equipment of Photovoltaic Assembly (PV) through soldering tabs to cell contacts. The extremely low solids content (1.6%) and nature of the activator system results in practically no residue left on the cell after soldering. SF855-LR has a wide operating window and temperature range, and can be used in SnPb, SnAgPb and Pb-free applications.
Industry News | 2016-04-11 17:47:04.0
Kester will be exhibiting together with Gardner & Meredith at the 20th Annual Atlanta SMTA EXPO, which will take place on April 20 at the Infinite Energy Center (formerly Gwinnett Center) in Duluth, GA.
Industry News | 2023-10-09 09:21:57.0
Indium Corporation is proud to count three of its experts amongst the presenters participating in the technical program at the upcoming IMAPS International Symposium on Microelectronics, October 3-5 in San Diego, California, U.S.
Industry News | 2008-06-11 18:26:39.0
FINE LINE STENCIL announces Slic Blade™, its newest line of squeegee blades, and a SMT VISION Award winning product.
Industry News | 2008-10-29 18:01:57.0
GREELEY, CO � October 2008 � FCT Assembly announces that FCT Asia has appointed Electroloy Metal to distribute the FCT assembly products including the Nihon Superior SN100 lead-free solder for sales in Hong Kong and China.
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Industry News | 2022-08-14 14:12:26.0
Indium Corporation® is proud to feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan.
Industry News | 2017-04-04 17:11:23.0
Kester will be exhibiting (booth # 4-533), at SMT Hybrid Packaging 2017, which will take place May 16-18 at the Exhibition Centre in Nuremberg, Germany.
Industry News | 2022-11-15 12:17:46.0
Indium Corporation's David Socha, technology assessment manager, will present on Indium Corporation's innovative 3D-EZ-Release™ build plate, a cutting-edge technology that allows for the quick release of powder bed fusion (PBF) metal printed parts, at the TCT Conference at Formnext at 12:20 p.m. on Friday, Nov. 18 in Frankfort, Germany.
