Industry News: flex and simulate (Page 1 of 23)

Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

SMTnet

PCB Engineering and Lenthor Engineering Merge

Industry News | 2003-02-19 09:34:32.0

Joined Forces to Continue Support of the Interconnect Market

SMTnet

Electronics Workbench Taps Industry Talent as New Vice President of Sales and Marketing

Industry News | 2003-03-04 08:31:59.0

Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market

SMTnet

Nordson ASYMTEK's Forte™ Series Increases Fluid Dispensing Precision, Accuracy, and Throughput

Industry News | 2019-08-21 16:17:24.0

Nordson ASYMTEK introduces its Forte™ Series fluid dispensing system. The Forte Series combines high accuracy fluid dispensing with increased throughput and productivity in a narrow footprint to handle applications such as flex circuit and printed circuit board assembly, electro-mechanical assembly, MEMS, underfill, precise coating, and encapsulation.

ASYMTEK Products | Nordson Electronics Solutions

SMTA International Conference and Expo Goes Virtual

Industry News | 2020-06-24 15:24:05.0

The Surface Mount Technology Association (SMTA) today announced that its annual conference and exhibition, SMTA International, will proceed for 2020 as a completely virtual event starting September 28, 2020.

Surface Mount Technology Association (SMTA)

IPC-4204A Provides Guidance on High Speeds and Fine Lines

Industry News | 2012-06-01 13:55:57.0

As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges

Association Connecting Electronics Industries (IPC)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

ITW EAE Wins Vision Awards for MPM Paste Management System and Electrovert Adjustable Wave

Industry News | 2020-08-28 03:07:38.0

ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.

ITW EAE

IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012

Industry News | 2010-04-19 12:56:32.0

BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.

Association Connecting Electronics Industries (IPC)

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