Electronics Forum | Sun Dec 19 10:02:55 EST 1999 | ron chua
Hi, how to ensure flexible boards do not warp after reflow and still remain flat for subsequent operations. What is the best way to hold and transport these strips from one process to another. Thanks!
Electronics Forum | Wed May 16 11:19:08 EDT 2012 | fulgen
Hi Guys, I´m looking for information about processing smt components on flexible printed circuits (printing, SMD assembly,reflow soldering and laser cuting). These flexible circuits comes from a roll of 300 mm width. I found some information about ro
Electronics Forum | Thu May 17 08:48:26 EDT 2012 | fulgen
Many thanks davef
Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef
Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies
Electronics Forum | Fri May 18 23:48:02 EDT 2012 | mspcb
Hi, Since you're looking information about flexible printed circuits,a book entitled "Printed Circuit Boards R. S. Khandpur" could give you lot of information about flex circuits from Design, Fabrication, and Assembly Phase. The book contains compr
Electronics Forum | Wed May 23 13:32:01 EDT 2012 | rrpowers
There is also a good reference book on flexible circuits from Joe Fjelstad. http://flexiblecircuittechnology.com/flex4/ This book covers everything from creating the flex circuitry itself to the assembly of flex circuits. Also, roll-to-roll assemb
Electronics Forum | Thu Aug 12 21:06:48 EDT 2010 | ptpaazmi
COLD SOLDER LOCATION U600/U601 Problem : Several XMp3i Rotary swithes were found to exibit intermittent function during a DV build at WNC
Electronics Forum | Tue Aug 24 20:15:27 EDT 2010 | davef
What is ... and how does it pertain? * Location U600/U601 * XMp3i Rotary swithes * DV build * WNC
Electronics Forum | Thu May 17 09:24:30 EDT 2012 | davef
These notes are from ~2005-6. I remember pictures of the pallets and the reliefs on the stencil. Bob may still have his presentation online. Check his site.
Electronics Forum | Mon May 21 11:14:06 EDT 2012 | joeherz
Polymide is like a sponge and absorbs moisture much faster than rigid substrates. Pre-bake your substrate for 2-4 hours at 125C and perform your soldering within 1 shift thereafter or seal in moisture barrier bags.
