A free dedicated, neutral site for flip chip information, including technical articles, tutorials, technology updates, and qualified suppliers.
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New Equipment | Cleaning Agents
pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues from a wide range of se
New Equipment | Cleaning Agents
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont
I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?
Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag
does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.
Used SMT Equipment | Pick and Place/Feeders
996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozz
Used SMT Equipment | X-Ray Inspection
CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Sold
Industry News | 2022-04-06 12:06:37.0
ZESTRON is pleased to announce that it will host "Defluxing of Copper Pillar Bumped Flip-Chips" on Tuesday, April 26th, from 11:00 AM to 12:00 PM EST. This is the second installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer. Ravi recently presented this study at APEX 2022, where he received an honorable mention, as well as IMAPS 2022.
Industry News | 2022-04-08 17:05:35.0
Manassas, VA – April 5th, 2022 ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will host "Defluxing of Copper Pillar Bumped Flip-Chips" on Tuesday, April 26th, from 11:00 AM to 12:00 PM EST. This is the second installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer.
Parts & Supplies | General Purpose Equipment
Samsung CP45 Machine SMC Compact Cylinder Original Used J9057035C Description: 1, Original Place: Korean 2, Part Name:Cylinder 3, Used For Samsung Machine We are supplying the following Parts CP 8*2MM 8*4MM 12MM 16MM 24MM 32MM 44MM 56MM FEE
Parts & Supplies | Assembly Accessories
Detailed Product Description Original: Japan Name: AC Servo Motor Conditon: Used Usage: CP60L Brand: Samsung Model: P50B02002DXS30 P50B02002DXS30 Servo Motor Driver For Samsung CP60L Z Axis Motor Original Description: 1, Original Place:
Technical Library | 2009-01-06 00:06:30.0
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
FOR SALE: Assembleon / Yamaha Opal XII smt pick and place pcb assembly machine running production. This machine is available fully functional from the Capital Equipment Exchange. http://www.ce-exchange.com/detail/assembleon-opal-xii-flex-placer-48
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ONLINE | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Apr 26 00:00:00 EDT 2022 - Tue Apr 26 00:00:00 EDT 2022 | Manassas, Virginia USA
Defluxing of Copper Pillar Bumped Flip-Chips April 26th
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | , | Engineering,Technical Support
COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot
SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip
ZESTRON Americas | https://www.zestron.com/us/applications/power-electronics-and-packages/flip-chip-packages.html
Flip Chip Packages Contact us SDS Request english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 繁體中文 日本語 한국어 русский IPA
GPD Global | https://www.gpd-global.com/dispense-flip-chip-bga.php
Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
