Industry Directory: flip chip (47)

FlipChips Dot Com

Industry Directory |

A free dedicated, neutral site for flip chip information, including technical articles, tutorials, technology updates, and qualified suppliers.

STATS ChipPAC Inc

Industry Directory | Other

STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.

New SMT Equipment: flip chip (421)

HYDRON® SE 220 True pH Neutral Defluxing for Semiconductor Electronics

HYDRON® SE 220 True pH Neutral Defluxing for Semiconductor Electronics

New Equipment | Cleaning Agents

pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues from a wide range of se

ZESTRON Americas

HYDRON® SE 230A

HYDRON® SE 230A

New Equipment | Cleaning Agents

Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro

ZESTRON Americas

Electronics Forum: flip chip (321)

flip chip tolerances

Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont

I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Used SMT Equipment: flip chip (27)

Siemens SIPlace 80 F3

Siemens SIPlace 80 F3

Used SMT Equipment | Pick and Place/Feeders

996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozz

Baja Bid

CR Tech CRX2000

CR Tech CRX2000

Used SMT Equipment | X-Ray Inspection

CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Sold

1st Place Machinery Inc.

Industry News: flip chip (472)

ZESTRON Academy to Host FREE "Defluxing of Copper Pillar Bumped Flip-Chips" Webinar

Industry News | 2022-04-06 12:06:37.0

ZESTRON is pleased to announce that it will host "Defluxing of Copper Pillar Bumped Flip-Chips" on Tuesday, April 26th, from 11:00 AM to 12:00 PM EST. This is the second installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer. Ravi recently presented this study at APEX 2022, where he received an honorable mention, as well as IMAPS 2022.

ZESTRON Americas

ZESTRON Academy to Host FREE "Defluxing of Copper Pillar Bumped Flip-Chips" Webinar

Industry News | 2022-04-08 17:05:35.0

Manassas, VA – April 5th, 2022 ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will host "Defluxing of Copper Pillar Bumped Flip-Chips" on Tuesday, April 26th, from 11:00 AM to 12:00 PM EST. This is the second installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer.

ZESTRON Americas

Parts & Supplies: flip chip (32)

Samsung Samsung CP45 Machine SMC Compact Cylinder Original Used J9057035C

Samsung Samsung CP45 Machine SMC Compact Cylinder Original Used J9057035C

Parts & Supplies | General Purpose Equipment

Samsung CP45 Machine SMC Compact Cylinder Original Used J9057035C Description: 1, Original Place: Korean 2, Part Name:Cylinder 3, Used For Samsung Machine We are supplying the following Parts CP 8*2MM 8*4MM 12MM 16MM 24MM 32MM 44MM 56MM FEE

KingFei SMT Tech

Samsung P50B02002DXS30 Servo Motor Driver For Samsung CP60L Z Axis Motor Original

Samsung P50B02002DXS30 Servo Motor Driver For Samsung CP60L Z Axis Motor Original

Parts & Supplies | Assembly Accessories

Detailed Product Description Original: Japan Name: AC Servo Motor Conditon: Used Usage: CP60L Brand: Samsung Model: P50B02002DXS30 P50B02002DXS30 Servo Motor Driver For Samsung CP60L Z Axis Motor Original Description: 1, Original Place:

KingFei SMT Tech

Technical Library: flip chip (36)

Cleaning High-power Electronics

Technical Library | 2009-01-06 00:06:30.0

To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary.

ZESTRON Americas

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Videos: flip chip (24)

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

Nordson ASYMTEK

Assembleon Opal XII Demonstration

Assembleon Opal XII Demonstration

Videos

FOR SALE: Assembleon / Yamaha Opal XII smt pick and place pcb assembly machine running production. This machine is available fully functional from the Capital Equipment Exchange. http://www.ce-exchange.com/detail/assembleon-opal-xii-flex-placer-48

Capital Equipment Exchange

Training Courses: flip chip (3)

Chip Scale Manufacturing Training Course

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

Events Calendar: flip chip (9)

Defluxing of Copper Pillar Bumped Flip-Chips April 26th

Events Calendar | Tue Apr 26 00:00:00 EDT 2022 - Tue Apr 26 00:00:00 EDT 2022 | Manassas, Virginia USA

Defluxing of Copper Pillar Bumped Flip-Chips April 26th

ZESTRON Americas

Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial

Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,

Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial

Surface Mount Technology Association (SMTA)

Career Center - Resumes: flip chip (9)

Arturo C Jadear Jr

Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support

6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process

12 Years experience in Equipment, Manufacturing and Technical Support.

Career Center | , | Engineering,Technical Support

COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot

Express Newsletter: flip chip (343)

SMTnet Express - November 15, 2018

SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip

Partner Websites: flip chip (3784)

Flip Chip Packages

ZESTRON Americas | https://www.zestron.com/us/applications/power-electronics-and-packages/flip-chip-packages.html

Flip Chip Packages Contact us SDS Request english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 繁體中文 日本語 한국어 русский IPA

ZESTRON Americas

Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing

GPD Global | https://www.gpd-global.com/dispense-flip-chip-bga.php

Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing   Home   Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader

GPD Global


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