Products, Services, Training, and Consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep & Sole Agent in North America for Shuttle Star BGA Rework Stations.
pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues from a wide range of se
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozz
Very Nice Camelot FXD 8000 Dispenser For Sale! Refurbished by the manufacturer Speedline Technologies - Camalot in 2013 See attached pictures and information below Equipment Description Camalot FXD Model Number: 8000-1 Serial Numbe
Industry News | 2022-04-06 12:06:37.0
ZESTRON is pleased to announce that it will host "Defluxing of Copper Pillar Bumped Flip-Chips" on Tuesday, April 26th, from 11:00 AM to 12:00 PM EST. This is the second installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer. Ravi recently presented this study at APEX 2022, where he received an honorable mention, as well as IMAPS 2022.
Industry News | 2022-04-08 17:05:35.0
Manassas, VA – April 5th, 2022 ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will host "Defluxing of Copper Pillar Bumped Flip-Chips" on Tuesday, April 26th, from 11:00 AM to 12:00 PM EST. This is the second installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer.
JUKI HIGHT SPEED SHOOTER KE2050 KE2060 KE2070 KE2080 KE1070 KE1080 FX-1R FX-2 FX-3 Sell & Buy smt machine and spare parts. Pls don't hesitate to contact me if you have any require,or wanted to sell smt machine. JUKI KJ-02 30% compared wit
PCB Support Pin Blocks Matrix Rubber Features: Just put the PCB board on the PCB Support Pin , you needn’t so any other things, it really save your time. Our PCB Support Pin is very soft, so all components on your PCB board will not be damaged.
Technical Library | 2009-01-06 00:06:30.0
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Training Courses | ONLINE | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Apr 26 00:00:00 EDT 2022 - Tue Apr 26 00:00:00 EDT 2022 | Manassas, Virginia USA
Defluxing of Copper Pillar Bumped Flip-Chips April 26th
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
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Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader