Industry Directory | Equipment Dealer / Broker / Auctions
World Equipment Source has over 20 years experience in Electronic Assembly Equipment. We will resell your equipment by utilizing our global market of associates.
Industry Directory | Consultant / Equipment Dealer / Broker / Manufacturer's Rep / Service Provider / Training Provider
Products, Services, Training, and Consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep & Sole Agent in North America for Shuttle Star BGA Rework Stations.
Scalable Fluid Dispensers for Assembly of Semiconductors, MEMS, Storage Devices, and PCBs. High Speed, High Accuracy, Precision Dispensing System. The Spectrum II Series is the next evolution of the widely successful Spectrum fluid dispensers from
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont
I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?
Used SMT Equipment | Pick and Place/Feeders
996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozz
Used SMT Equipment | Pick and Place/Feeders
Compact High Speed Mounter for LED placement at low cost. Compact but with 800×360 mm long board size capacity, the JX-100 LED is a low cost placement solution for notebook PCs, LCD monitors, and a wide variety of lighting equipment. Superior
Industry News | 2013-06-26 14:34:43.0
Nordson ASYMTEK will be hosting live demonstrations of precision coating and jetting processes at SEMICON West 2013. Engineers will be available to discuss equipment, applications, and the manufacturing process.
Industry News | 2022-04-06 12:06:37.0
ZESTRON is pleased to announce that it will host "Defluxing of Copper Pillar Bumped Flip-Chips" on Tuesday, April 26th, from 11:00 AM to 12:00 PM EST. This is the second installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer. Ravi recently presented this study at APEX 2022, where he received an honorable mention, as well as IMAPS 2022.
Parts & Supplies | Chipshooters / Chip Mounters
Ejector A010E1-44W+A010E1-37W+AME05-E2-PSL-27W KGS-M7171-A0X use for Smt YAMAHA pcb assembly equipment KGS-M7171-A0X EJECTOR 44W+37W+27W KM1-M7163-20X VALVE 37W KM1-M7163-30X VALVE 44W KM5-M7174-C1X EJECTOR BASE Part nr.: 9498 396 01089 Ejecto
Parts & Supplies | Assembly Accessories
The JUKI high-speed patch machine FX-1R corresponds to a high-speed mount using an advanced linear motor and a unique HI-Drive mechanism, which inherits the traditional concept of a modular mount machine and realizes a high-speed mount machine. Reaso
Technical Library | 2009-01-06 00:06:30.0
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | ONLINE | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Apr 26 00:00:00 EDT 2022 - Tue Apr 26 00:00:00 EDT 2022 | Manassas, Virginia USA
Defluxing of Copper Pillar Bumped Flip-Chips April 26th
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip
ZESTRON Americas | https://www.zestron.com/us/applications/power-electronics-and-packages/flip-chip-packages.html
Flip Chip Packages Contact us SDS Request english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 繁體中文 日本語 한국어 русский IPA
GPD Global | https://www.gpd-global.com/dispense-flip-chip-bga.php
Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
