Industry Directory: flip chip assembly (161)

World Equipment Source / R1 Source, Inc.

Industry Directory | Equipment Dealer / Broker / Auctions

World Equipment Source has over 20 years experience in Electronic Assembly Equipment. We will resell your equipment by utilizing our global market of associates.

Precision PCB Services, Inc

Industry Directory | Consultant / Equipment Dealer / Broker / Manufacturer's Rep / Service Provider / Training Provider

Products, Services, Training, and Consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep & Sole Agent in North America for Shuttle Star BGA Rework Stations.

New SMT Equipment: flip chip assembly (6359)

Spectrum II S2-900 Series Fluid Dispensers

Spectrum II S2-900 Series Fluid Dispensers

New Equipment | Dispensing

Scalable Fluid Dispensers for Assembly of Semiconductors, MEMS, Storage Devices, and PCBs. High Speed, High Accuracy, Precision Dispensing System. The Spectrum II Series is the next evolution of the widely successful Spectrum fluid dispensers from

Nordson ASYMTEK

DJ-2200 DispenseJet Non-Contact Flux Jet

DJ-2200 DispenseJet Non-Contact Flux Jet

New Equipment | Dispensing

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi

Nordson ASYMTEK

Electronics Forum: flip chip assembly (624)

Conductive Adhesives and flip chip

Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan

HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver

flip chip tolerances

Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont

I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?

Used SMT Equipment: flip chip assembly (90)

Siemens SIPlace 80 F3

Siemens SIPlace 80 F3

Used SMT Equipment | Pick and Place/Feeders

996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozz

Baja Bid

Juki JX-100 LED Compact LED Assembly

Juki JX-100 LED Compact LED Assembly

Used SMT Equipment | Pick and Place/Feeders

Compact High Speed Mounter for LED placement at low cost. Compact but with 800×360 mm long board size capacity, the JX-100 LED is a low cost placement solution for notebook PCs, LCD monitors, and a wide variety of lighting equipment. Superior

KingFei SMT Tech

Industry News: flip chip assembly (1213)

Nordson ASYMTEK To Exhibit Coating, Jetting & Dispensing Systems at SEMICON West 2013

Industry News | 2013-06-26 14:34:43.0

Nordson ASYMTEK will be hosting live demonstrations of precision coating and jetting processes at SEMICON West 2013. Engineers will be available to discuss equipment, applications, and the manufacturing process.

Nordson ASYMTEK

ZESTRON Academy to Host FREE "Defluxing of Copper Pillar Bumped Flip-Chips" Webinar

Industry News | 2022-04-06 12:06:37.0

ZESTRON is pleased to announce that it will host "Defluxing of Copper Pillar Bumped Flip-Chips" on Tuesday, April 26th, from 11:00 AM to 12:00 PM EST. This is the second installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer. Ravi recently presented this study at APEX 2022, where he received an honorable mention, as well as IMAPS 2022.

ZESTRON Americas

Parts & Supplies: flip chip assembly (1016)

Yamaha Ejector A010E1-44W+A010E1-37W+AME05-E2-PSL-27W smt parts KGS-M7171-A0X for YAMAHA pcb assembly equipment

Yamaha Ejector A010E1-44W+A010E1-37W+AME05-E2-PSL-27W smt parts KGS-M7171-A0X for YAMAHA pcb assembly equipment

Parts & Supplies | Chipshooters / Chip Mounters

Ejector A010E1-44W+A010E1-37W+AME05-E2-PSL-27W KGS-M7171-A0X use for Smt YAMAHA pcb assembly equipment KGS-M7171-A0X EJECTOR 44W+37W+27W KM1-M7163-20X VALVE 37W KM1-M7163-30X VALVE 44W KM5-M7174-C1X EJECTOR BASE Part nr.: 9498 396 01089 Ejecto

KingFei SMT Tech

Juki JUKI high-speed patch machine FX-1R product

Juki JUKI high-speed patch machine FX-1R product

Parts & Supplies | Assembly Accessories

The JUKI high-speed patch machine FX-1R corresponds to a high-speed mount using an advanced linear motor and a unique HI-Drive mechanism, which inherits the traditional concept of a modular mount machine and realizes a high-speed mount machine. Reaso

KingFei SMT Tech

Technical Library: flip chip assembly (49)

Cleaning High-power Electronics

Technical Library | 2009-01-06 00:06:30.0

To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary.

ZESTRON Americas

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Videos: flip chip assembly (286)

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

Nordson ASYMTEK

Spectrum II - Solder Paste Dots & Lines

Spectrum II - Solder Paste Dots & Lines

Videos

With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su

Nordson ASYMTEK

Training Courses: flip chip assembly (18)

IPC-7711/7721 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: flip chip assembly (91)

Defluxing of Copper Pillar Bumped Flip-Chips April 26th

Events Calendar | Tue Apr 26 00:00:00 EDT 2022 - Tue Apr 26 00:00:00 EDT 2022 | Manassas, Virginia USA

Defluxing of Copper Pillar Bumped Flip-Chips April 26th

ZESTRON Americas

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Resumes: flip chip assembly (51)

resume

Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing

• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.

Arturo C Jadear Jr

Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support

6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process

Express Newsletter: flip chip assembly (1005)

SMTnet Express - November 15, 2018

SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip

Partner Websites: flip chip assembly (6980)

Flip Chip Packages

ZESTRON Americas | https://www.zestron.com/us/applications/power-electronics-and-packages/flip-chip-packages.html

Flip Chip Packages Contact us SDS Request english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 繁體中文 日本語 한국어 русский IPA

ZESTRON Americas

Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing

GPD Global | https://www.gpd-global.com/dispense-flip-chip-bga.php

Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing   Home   Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader

GPD Global


flip chip assembly searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next
Precision Auger Dispense Pump

Want to know where to find the best AOI system? - Read testimonials.
Flux-Free Reflow Soldering

One-stop Platform For All Your Need For SMT - QYSMT
Selective soldering solutions with Jade soldering machine

World's Best Reflow Oven Customizable for Unique Applications
Pillarhouse USA for Selective Soldering Needs

World Source Equipment: Used equipment sale. Hundreds of items on sale.