Electronics Forum | Wed Jan 13 19:13:59 EST 1999 | Michael Allen
Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype" line at our component supplier's lab (non-production overmold material was used). Production parts have not exhibite
Electronics Forum | Thu Jan 14 08:32:22 EST 1999 | Jim Nunns
They are supposed to be production parts. Our volumes are in the hundreds due to rapid change though. Jim Nunns | Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype"
Electronics Forum | Wed Jan 13 17:08:20 EST 1999 | Jim Nunns
I have some BGAs with a warped chip carrier. Some of the balls are tall like columns and some are short oval shapes. How can I determine when warpage will cuase failures from stress. Is there a spec out there from studies anyone has done? Any commen
Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg
Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su
Electronics Forum | Mon Jan 22 12:25:03 EST 2001 | dbonilla
Hi: I am looking for companies or consultants that can assists Manufacturing Technology Services ( Technology Alliance Division) to grow in advanced technology processes like BGA, Flip Chip, flex circuits, COB and others. I wish to know availability
Electronics Forum | Sun Jan 28 15:34:01 EST 2001 | Kelvin
Dear David, I suppose you may contact Cookson Performance Solution. They offer quite a wide range of service. http://www.cooksonsolutions.com I hope you find it useful. Kelvin
Electronics Forum | Mon Jan 29 10:26:21 EST 2001 | CAL
David- The information you ask about is what we deal with on an every day basis. We can entertain your questions off line at your convenience. The POC here at ACI you need to speak with is Mike Czajkowski (CHI-Kow-ski). He should be able to provide d
Electronics Forum | Wed Aug 05 11:08:36 EDT 2009 | spitkis2
Hi, This may be a bit off the subject but thought I'd ask just in case. I am looking to identify a process / equipment for attaching solder balls to flip chips. Solder balls are 75 microns in diameter. With BGA's there are reballing kits that use
Electronics Forum | Tue Jan 12 15:04:40 EST 1999 | Earl Moon
| I have used conductive adhesives for some time now on thickfilm. Does anyone know of a really good conductive adhesive to attach flip chips to flex circuits? I would like to stencil print the adhesive to the substrate and then place the flips chi
Electronics Forum | Fri Aug 24 09:38:17 EDT 2001 | gerits
Hi, you can use the Assembleon (Philips) ACM Micro for this. It can place Flip Chip form 0,1x0,1mm upto micro BGA, CSP's etc. etc. It even can handle Odd's and insert components. Web-site http://www.assembleon.com Please contcat me or our company o
