Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bo
Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bo
Industry News | 2015-07-10 13:55:54.0
Carlsbad, CA – July 10, 2015: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the MVP 850 Platform for Microelectronics and Packaging AOI platform at the Semicon West 2015 exhibition. The exhibition is at the Moscone Center in San Francisco from July 14-16 2015. Machine Vision Products are exhibiting at booth #6254 in the North Hall.
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process