The new iineo+ is a highly specified machine , configured with new design, new RC 5.16 platform software and integrated electrical tester. It delivers a step-change in value for production-wide management, process refinement and user accessibility.
pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues from a wide range of se
Electronics Forum | Tue Oct 03 16:55:26 EDT 2000 | Chris
Does anyone have any recomendations for a NC flip chip attach flux? I have info from Indium and Kester. Who else makes a good flux for flip chip. I will be dispensing this flux using a doctor blade and rotating disk. I will then dip the flip chip
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
Ultra popular machine (not an i style) in excellent condition with feeders available. 9.6k / 11.6k cph (IPC 9850 / rated for Opal-X” with 4 heads) 13.9k / 17.7k cph (IPC 9850 / rated for Opal-X” with 8 heads) 01005 (0402) - 45 mm sq. (1.
Industry News | 2013-08-20 23:02:16.0
Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.
Industry News | 2018-07-03 16:39:38.0
ZESTRON will feature HYDRON® SE 200 at the SMTA Ohio Expo. HYDRON® SE 220 is a pH neutral, water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues from a wide range of semiconductor electronics, such as leadframes, discrete devices, power modules, power LEDs, flip chips and CMOS following the die attach process. The SMTA Ohio Expo will be held at the Embassy Suites in Cleveland, Ohio on July 12th. For more information or to register, please visit smta.org.
SMT Siemens feeder 88mm FEEDER 00141070 used in smt machine Specification Part Numbre 2x8mm FEEDER 00141096 3x8mm Gold FEEDER 00141099 3x8mm Silver FEEDER 00141098 3x8mm SL FEEDER 00141088 12/16MM FEEDER 00141092 24/32MM FEEDER 00141093 44MM
SMT Siemens feeder 72mm FEEDER 00141097 used in smt machine Specification Part Numbre 2x8mm FEEDER 00141096 3x8mm Gold FEEDER 00141099 3x8mm Silver FEEDER 00141098 3x8mm SL FEEDER 00141088 12/16MM FEEDER 00141092 24/32MM FEEDER 00141093 44MM
Technical Library | 2009-01-06 00:06:30.0
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary.
Technical Library | 2009-09-18 14:42:37.0
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil.
FOR SALE: Assembleon / Yamaha Opal XII smt pick and place pcb assembly machine running production. This machine is available fully functional from the Capital Equipment Exchange. http://www.ce-exchange.com/detail/assembleon-opal-xii-flex-placer-48
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | , | Engineering,Technical Support
COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot
SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip
. It can also change product orientation, such as flipping upside down or 180 degrees, for transport. The wedge elevator has two specialty chains situated parallel to each other
’ spare parts, such as Feeders/ Nozzles / Camera / Motors / Driver / Controller / Squeegee / Sensor and all other spare parts. And we have also invested to design and product SMT PCB magazine Loader / Unloader / Efficient PCB Buffer / Conveyor / Automatic Flipping machine / Automatic Splicing machine / SMT Automatic Splicing