New SMT Equipment: flux buster ict pins (2)

Sawa Ultrasonic Stencil Cleaners

Sawa Ultrasonic Stencil Cleaners

New Equipment | Cleaning Equipment

Precision Fine Pitch Aperture Cleaners Thousands of dollars less than fully-automatic cleaners Low solvent usage and running costs Fast cleaning time of 1-3 minutes Minimal waste disposal Portable unit can be used directly on the screen printe

Seika Machinery, Inc.

4300/LF-4300 Water Washable No-Clean Solder Paste

4300/LF-4300 Water Washable No-Clean Solder Paste

New Equipment | Solder Materials

Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,

AMTECH

Electronics Forum: flux buster ict pins (20)

Flux residue cause high false reject at ICT

Electronics Forum | Fri Dec 08 06:34:55 EST 2006 | Rob

Try flux buster ICT pins.

SMT Solder paste and wave flux evaluation

Electronics Forum | Fri Jan 28 12:18:32 EST 2005 | Chunks

Your best bet is to do a decision making matrix. Each company has so many different criteria�s it's hard to pick out which one might be important to yours. Simply pick out your top 5 paste manufactures. Next decide what your "Eliminators" are - th

Industry News: flux buster ict pins (11)

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Industry News | 2017-11-28 09:32:15.0

SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 To Solve HoP Issues and Improve ICT Testability at SMTAI Exhibition

Industry News | 2017-09-12 20:15:18.0

SHENMAO Technology introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

Parts & Supplies: flux buster ict pins (3)

Juki SMT process flow

Juki SMT process flow

Parts & Supplies | Pick and Place/Feeders

SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair     1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f

ZK Electronic Technology Co., Limited

Cyberoptics camera 8008632 supply&repair

Cyberoptics camera 8008632 supply&repair

Parts & Supplies | Pick and Place/Feeders

CYBEROPTICS laser/CYBEROPTICS camera:JUKI laser(570/620/730/740/750/760/2010/2020/2030/2040/2050/2060/2070/2080/KJ-01/KJ-02//FX-1/FX-2/FX-3/3020R/JX-100 laser unit),YAMAHA laser,SAMSUNG laser,TENRYU laser,PHILIPS(ASSEMBLEON) FCM PPU laser,Autotronik

FUJINTAI TECHNOLOGY CO.,LIMITED

Technical Library: flux buster ict pins (5)

Press Fit Technology Roadmap and Control Parameters for a High Performance Process

Technical Library | 2016-10-27 16:24:23.0

Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors. The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes, Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering, rework, thermal cycles, installation and repair. This paper investigates the technical roadmap for press fit technology, putting special attention to main characteristics such, placement and insertion, inspection, repair, pin design trends, challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted.

Flex (Flextronics International)

Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly

Technical Library | 2015-08-20 15:18:38.0

Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices. Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results.

Celestica Corporation

Videos: flux buster ict pins (1)

SAWA SC-7000CE Portable ultrasonic cleaner Demo

SAWA SC-7000CE Portable ultrasonic cleaner Demo

Videos

Precision Fine Pitch Aperture Cleaners Thousands of dollars less than fully-automatic cleaners Low solvent usage and running costs Fast cleaning time of 1-3 minutes Minimal waste disposal Portable unit can be used directly on the screen printe

Seika Machinery, Inc.

Express Newsletter: flux buster ict pins (414)


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Best Reflow Oven
PCB Handling Machine with CE

PCB Assembly Supplies - ONLINE STORE
Jetting Pump for Integration

Easily dispense fine pitch components with ±25µm positioning accuracy.