Industry Directory | Manufacturer / Other
We are Japanese based solder manufacturer under Nihon Genma Mfg Co Ltd. Our company located in Malaysia and we distribute solder products worldwide. We are looking for aggresive business partner around the world. Contact us!!
Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
New Equipment | Cleaning Equipment
Features: 1. A comprehensive cleaning system: the surface of the product residues of organic matter, inorganic substances for thorough and effective cleaning; 2. Automatic cleaning mode: in a clean room to complete the cleaning, rinsing, drying all
New Equipment | Cleaning Equipment
Features: 1. A comprehensive cleaning system: the surface of the product residues of organic matter, inorganic substances for thorough and effective cleaning; 2. Automatic cleaning mode: in a clean room to complete the cleaning, rinsing, drying all
Electronics Forum | Mon Mar 29 09:33:37 EST 1999 | Chrys Shea
| I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | What disadvantages are there when using this flux? | Do you have any contact details with
Electronics Forum | Tue Mar 30 08:11:27 EST 1999 | George Steele
| | I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | | What disadvantages are there when using this flux? | | Do you have any contact detail
Used SMT Equipment | Board Cleaners
Aqueous Technologies Batch Cleaner For Sale Excellent Running Condition Aqueous Technologies Model: Trident - CLO Serial Number: 9356 Year 2014-2015 Type: PC Board De-fluxing Cleaner aSPC Software Stainless Steel Wash Chamber Touch Scree
Used SMT Equipment | Board Cleaners
Trident ZDO, Single Chamber Flux Remover Vintage 3/5/2020 Deinstalled and located in MI Serial number 9930 Removes All Flux Types, Closed-Loop (Zero Discharge) Wash Cycle, Closed-Loop (Zero Discharge) Rinse Cycle Automatic Wash, Rinse & and Dry Cycle
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | Soldering - Wave
Overseas Agent and Distributor Wanted ! Features : Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted according to PCB board width and moving speed to ensure even spraying all time. 2) Durable “Meiji
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
Unsurpassed cleaning, high-efficiency drying, low cost of ownership, ease of maintenance, and minimum downtime all come together in the ELECTROVERT Aquastorm, a world-class printed circuit board cleaning system. As high-reliability PCBs become minia
