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BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
Industry Directory | Consultant / Service Provider
We are your obsolete industrial product specialists. Our inventory includes VME, cPCI, ATCA, SBCs and much more industrial electronics
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Electronics Forum | Wed Aug 23 16:37:07 EDT 2006 | flipit
If you bought this camera from Universal, it should come focused correctly. I had one of the first 0.5 mil cameras for flip chips. I used it for years and it was out of focus. I finally convinced Universal that something was wrong and they replace
Electronics Forum | Wed Aug 23 09:25:32 EDT 2006 | SWAG
I just installed a new CCD in a 4.0 mil upward looking camera - GSM. It's working well but is slightly out of focus. Do I adjust focus by moving the lense in and out of the camera mount or do I use the ring that is actually part of the camera that
Used SMT Equipment | Visual Inspection
FEIN FOCUS, X Ray inspection machine, type FXS160/31, s.n. 14000020 666, out of order for maintenance, size approx.1,60x1,70x2,40 meters, year 1998, CE Marked
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | SMT Equipment
JUKI laser sensor JUKI 750 laser E9631721000 SENSOR JUKI 750laser E9630721000 LAHD ASM JUKI740 laser E9635725000LA SENSOR （TOP CONNECTOR） JUKI740 laser E9635725000 FOCUSE MODULAR LAUNI JUKI760 laser E9635725000 FOCUSE MODULA
Parts & Supplies | SMT Equipment
Laser unit of KE2080 We have spare parts for all the folloiwng JUKI laser sensor. At the same time, we provide professional repair service for them. JUKI 750 E9631721000 SENSOR JUKI 750 E9630721000 LAHD ASM JUKI740 E9635725000
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
► Exclusive 15MP / 25MP CoaXPress Camera System ► OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology ► Leading-Edge 12 Projection Blue DLP Technology ► Precision Compound Telecentric Camera Lens ► Eight Phase Color Lighting System
► Exclusive 15MP / 25MP CoaXPress Camera System ► OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology ► Leading-Edge 12 Projection Blue DLP Technology ► Precision Compound Telecentric Camera Lens ► Eight Phase Color Lighting System
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ONLINE | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Jul 22 00:00:00 EDT 2021 - Thu Jul 22 00:00:00 EDT 2021 | ,
Webinar: Effective Strategies to Sharpen Your Focus and Concentration
Events Calendar | Tue Nov 05 00:00:00 EST 2019 - Thu Nov 07 00:00:00 EST 2019 | Minneapolis, Minnesota USA
IPC Electronics Materials Forum 2019
Career Center | Los Angeles, California USA | Sales/Marketing
Quickshot XRF is looking to expand our distribution network for RoHS Testing needs. The primary area of interest is a sales organization based on the West Coast but consideration will be given to any sales company that has a dedicated focus on suppl
Career Center | Atlanta, Georgia USA | Engineering
Our client is an electronics manufacturing firm. They have a need for a quality assurance engineer now! Location is mid-South.
Career Center | Ballston Spa, New York USA | Engineering,Maintenance,Production,Purchasing,Quality Control,Research and Development,Sales/Marketing,Technical Support
Qualifications / Skills: Maintain and repair X-Ray inspection equipment Maintain Surface Mount Manufacturing Systems Full DEK OEM equipment training Train Surface Mount Technology, Semiconductor, and Solar Photovoltaic operators and engineers Mainta
Career Center | San Diego, Michigan USA | Sales/Marketing
* Results driven Sales Executive combining expertise in Building Sales networks and strategic business development in the Electronic Component, Connector, and Electronic Manufacturing Equipment industries * Extensive Field Sales experience with a tra
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/
> Focusing on the SMT field for more than 15 years, QYSMT has been committed to meeting the needs of customers and partners. Our mission is to provide the best solutions while helping to reduce costs and increase efficiency. Why choose us
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1066-voids-in-solder
. The image was generated at 50 MHz by focusing through the copper base to the copper base/ceramic substrate interface. Result The black areas observed in the substrate regions (multi-colored areas
