Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Industry News | 2024-03-11 14:58:44.0
New this year, student scholarship awarded by IPC Education Foundation
Industry News | 2021-05-11 14:58:49.0
Z1 Foil Technology improves overall environmental performances and long-term stability
Industry News | 2021-01-19 13:51:42.0
New Micro-Measurements Advanced Sensors Technology C4A Series Strain Gages Enable Easy, No-Solder Installation
Industry News | 2009-03-10 16:11:29.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2020-12-01 17:17:03.0
Indium Corporation's Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, December 9 at 12 p.m. Eastern Time (5 p.m. British Time/1 a.m. Thursday, Dec. 10 Malaysia Time).
Industry News | 2020-06-18 14:22:04.0
Indium Corporation's Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation's InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.
Industry News | 2022-09-19 05:59:24.0
Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.
Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2023-11-20 15:34:41.0
Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.
