Industry Directory | Consultant / Service Provider / Media / Publisher / Online Resource / Other
PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
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Global OEM manufacturer of selective wave soldering machines. With a world-wide install base in over 65 countries, we are a global leader in the selective soldering space. Highly customized solutions available in all industries.
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
New Equipment | Board Handling - Conveyors
Model No: KSUN 460A Destacker / Push-up Stacker MAX PCB`s capacity: 300pcs (0.6mm thickness PCB) cycling time: Approx 8 seconds Power supply: 100-230V AC (customized), single phase Power load: MAX 150 VA Air pressure: 4-6 bar Air volume: MAX
Electronics Forum | Sat Jun 12 10:59:59 EDT 1999 | WillyW
Is there public domain information available on standard surface mount package outlines and footprints? Thanks, WillyW
Electronics Forum | Tue Mar 02 10:19:41 EST 2004 | loz
Hi all, we have recently seen a design that consists off a QFP100, pitch at 25". Also in the centre of this footprint is a FBGA165 footprint, pad size .4mm @ 1mm pitch. We have been informed that we will fit the QFP. I want to remove the BGA pads fr
Used SMT Equipment | Stencil Cleaners
EMC Cyberclean 200 Inline Washer Serial: 54912/60202 Features: Wash/Rinse/Dry Chambers Compact Footprint 12' 24" width Conveyor Chain Paxton Blowers Item Location: Brooksville, FL USA
Used SMT Equipment | Soldering - Reflow
1996 Vitronics Unitherm 520A Reflow Oven Features: 5 Heat Zones Top and Bottom / 2 Cool Zones o Edge and Mesh o Set up for Air - Nitrogen Capable o 220v 3 phase 105 amp o 12’ x 5’ Footprint
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2017-08-19 13:31:56.0
GPD Global will demonstrate its Hyperion dispense system in booths 1C03 & 1C10 at upcoming NEPCON South China 2017. This fully automated dispense platform incorporates the latest technology from GPD Global in a compact footprint. Equipped with linear motor drives, smart pump technology, full touch screen interface, vision centric system operation & more, this is a dispense system not to be missed.
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Parts & Supplies | Pick and Place/Feeders
0402 Ceramic Blade Nozzle (3030) – p/n 51305433 You might ask, “What’s the difference between this nozzle and the older conical 0402 ceramic nozzle?” Simply put, we think this latest design is a far superior option. Here&
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Parts & Supplies | Pick and Place/Feeders
0603 Ceramic Blade Nozzle 3040 51305434 We were so impressed with the new long-life ceramic 0402 nozzle (#3030) we launched earlier in 2014 that we decided to follow it up with an 0603 version! Now customers can reap the benefits of our ESD-Safe ce
Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Technical Library | 2019-06-06 13:40:47.0
Legacy electronics assemblies, such as through-hole (Figure 1) and connectorized component packages, are robust and prevalent throughout industry. However, each of these assembly methods have reached their limits in terms of weight, volume, reliability, and most importantly cost. With cost reduction of assemblies now the primary focus area throughout the electronics industry, there is more of a need than ever to implement the latest advancements in surface mount technology (SMT) into electronics assembly designs. Although SMT has been utilized in the electronics industry for many years, implementation of the technology is still in the ever-evolving process of reducing component footprint size, component spacing, and component I/O pitch. Implementation of the most up-to-date SMT processes provides optimal weight, volume, and cost savings, for any type of assembly.
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Thu Mar 26 00:00:00 EDT 2020 - Thu Mar 26 00:00:00 EDT 2020 | ,
Water-based fluxes - opportunities and application notes
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Career Center | Newport Beach, California USA | Engineering,Management,Production
KEVIN RAGER P.O.BOX 7878, NEWPORT BEACH, 949 922 8997, KEVIN.RAGER@EDA-INC.US OBJECTIVE I am trying to find a consistent work flow that provides mentally challenging yet stimulating experiences in design and prototype development. EXPERIENCE 1997
Imagineering, Inc. | https://www.pcbnet.com/blog/considerations-for-pcb-board-design-layout/
. Schematics based on hierarchies also show how each schematic operates in relation to others in a complete PCB. A PCB schematic should be created before handling PCB footprints, as it serves as a guide that shows the current and layout of a circuit
| https://fluxconnectivity.com/company/sustainability/
spaces to reduce carbon footprint. 3 Leveraging technology to replace paper consumables. 4 Lean business model reduces physical facility footprints therefore reducing energy consumption
