Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Electronics Forum | Mon Oct 30 09:47:56 EST 2006 | pjc
If you are using VOC free flux, then forced convection preheats are better at evaporating the water. That may be why you're getting the "splatter". Plus, forced convection preheaters are most efficient at thermal transfer. See if you can get one to p
Electronics Forum | Tue Oct 31 05:27:30 EST 2006 | Loco
Hi Ronald, We have both, 2x calrod on our leaded delta and calrod/convection on our leadfree, both are IR in 3th zone. Indeed, the forced convection is way more efficient, we can run it at 100deg C, where we would need 300deg C for the calrod for t
Used SMT Equipment | Soldering - Reflow
Conceptronic HVA 102 Forced Convection Oven Make: Conceptronic Model: HVA 102 Description: High Velocity Forced Convection Oven Condition: Complete & Operational Location: USA Availability: Immediate Shipping: EXW Origin Terms: 100% Prepay Please con
Used SMT Equipment | Soldering - Wave
This machine will be coming available for purchase. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version V4.6
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Parts & Supplies | Pick and Place/Feeders
Pick + Place-Modul/High-Force
Parts & Supplies | Pick and Place/Feeders
Board w. cable, P+P High Force
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:37:45.0
Various international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry's environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Events Calendar | Fri Jun 07 00:00:00 EDT 2019 - Fri Jun 07 00:00:00 EDT 2019 | San Jose, California USA
ITI and IPC Conference on Emerging & Critical Environmental Product Requirements
Events Calendar | Mon Jun 03 00:00:00 EDT 2019 - Mon Jun 03 00:00:00 EDT 2019 | Boston, Massachusetts USA
ITI and IPC Conference on Emerging & Critical Environmental Product Requirements
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BS degree in engineering (Mech or Chem)Provide daily support to sales force with regard to assigned products (pump models) This includes tech support, special pricing and product information. Also, assist other depts w/problems
Career Center | Mountainside, New Jersey USA | Sales/Marketing
Develop and execute Marketing plan Knowledge of thermocouples and oven profiling necessary establish rep sales force develop literature and train sales channel
Career Center | Buford, Georgia USA | Technical Support
Over 9 years of Assembleon Electronic Manufacturing Equipment training and support. Primary machine experience: FCM I, II, and Multi-Flex, ACM Micro and AX. Dedicated CTT+ Certified Training Professional. Experienced in Instructor-led training an
Career Center | Lakewood, California USA | Engineering,Management,Production
Previous management / supervisor experience. Quality conscious, detail oriented supervisor / manager, with hands on approach to customer service Motivated with excellent communication skills and a dedicated team player. Qualifications include:
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/forced-body-color-change-issue_topic2812_post11205.html
Forced Body Color Change Issue - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Forced Body Color Change Issue
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/ultralow.pdf
. Forced convection heating modules create turbulence when the hot gas streams exiting the module impact the circuit board and are then sucked back up into the heater module
