Electronics Forum | Wed Nov 10 20:48:40 EST 2004 | kbpes
I also had a problem with getting the file information from Mydata. I saw your reply to another posting and would like to know if you could send the Mydata information to me. If you could it would be very helpful.
Electronics Forum | Wed Jul 25 02:40:24 EDT 2018 | cannizzaro
I have a question about the Gerber file format for PCB prototype. The CAD program I am using is a DOS version and generates Gerber files in the RS-274-D format. However, ALLPCB require the Gerber files in the RS-274-X format. I have to approach other
Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef
Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we
Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap
I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe
Electronics Forum | Thu Jul 03 08:40:23 EDT 2003 | Kris
Hi, undercured solder resists may be a defect people have seen so far. Some of the probles arising is blistering as well as reaction with wave solder flux that may lead to some kind bad gel like formations. Gels the idea would be to reflow the ba
Electronics Forum | Mon Jun 02 11:01:19 EDT 2003 | emeto
Hi All, I am looking for some standart for pad and component dimencions. Is there anything more accurate than 30% and if so who works with it? Which libraries are based on some standart? Is there a catalog I can read or something in electronic format
Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo
No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Fri Apr 10 20:04:00 EDT 2020 | jlawson
> Fabrication Format. With good tools Like Valor MSS PP you can handle the old (legacy flows) and of course better more modern flows all from one learning library solution = more effective first time right outputs
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
