Partner Websites: formulas (Page 1 of 3)

The Fundamentals of Solder Joint Design – Part 2 – Surface Mount Technology (SMT) | EPTAC

| https://www.eptac.com/webinar/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt/

. We continue with this series by reviewing the soldering process as it relates to SMT assemblies and how we can best interpret formulas and calculations that lead us in a direction to better

The Fundamentals of Solder Joint Design – Part 2 – Surface Mount Technology (SMT) - EPTAC - Train. W

| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt

. We continue with this series by reviewing the soldering process as it relates to SMT assemblies and how we can best interpret formulas and calculations that lead us in a direction to better

The Fundamentals of Solder Joint Design – Part 1 – Through Hole Technology (THT) - EPTAC - Train. Wo

| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht/

? Take a moment to spend some time with us as we review some of the fundamentals and formulas that help us at least get in a comfortable ballpark for these predictions

The Fundamentals of Solder Joint Design – Part 2 – Surface Mount Technology (SMT) - EPTAC - Train. W

| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt/

. We continue with this series by reviewing the soldering process as it relates to SMT assemblies and how we can best interpret formulas and calculations that lead us in a direction to better

The Fundamentals of Solder Joint Design – Part 1 – Through Hole Technology (THT) - EPTAC - Train. Wo

| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht

? Take a moment to spend some time with us as we review some of the fundamentals and formulas that help us at least get in a comfortable ballpark for these predictions

Thermal Interface Materials (TIM) | Thermal Compound | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/thermal-compounds/thermal-compound

. Depending on application requirements, users can choose from a wide array of formulas, each with unique features and benefits. Common Features Excellent heat transfer Non-silicone Non-hazardous Will not dry, harden, or melt in normal use Long shelf-life stability RoHS and REACH compliant (lead-free

ASYMTEK Products | Nordson Electronics Solutions

PCB Libraries Forum : Stencil Window Pane Design Example for QFN

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_stencil-window-pane-design-example-for-qfn_topic2481.xml

;I saw some information from IPC-7525 but i really don't understand those formulas. It would be possible to give me a simple example for a 3 x 3 cm square thermal pad? 

PCB Libraries, Inc.

Refrigerated and Frozen Adhesive Preformed Films - Featured Materials

ORION Industries | http://orionindustries.com/motm-2017-04.php

; films, however, deliver uniform, void-free bondlines and controlled thicknesses. Supplied in custom, pre-cut formats, Henkel’s® line of thermal adhesive films offers a clean, waste-free, easily-processed solution with a low total, cost of ownership in thermally and electrically-conductive formulas. Henkel’s®

ORION Industries

Solder Selection Guide

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide

. Two flux formulas can differ greatly in performance, despite having the same QQ-S-571E and J-STD-004 classifcations. Solder pastes with specific characteristics can be used to solve technical assembly problems that other forms of solder do not

ASYMTEK Products | Nordson Electronics Solutions

Stencil Window Pane Design Example for QFN - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/stencil-window-pane-design-example-for-qfn_topic2481_post10229.html

?  I saw some information from IPC-7525 but i really don't understand those formulas.  It would be possible to give me a simple example for a 3 x 3 cm square thermal pad

PCB Libraries, Inc.

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