Through the process of CNC routing, we are able to cut with precision electronic insulation products including thicker gauge materials. We also process composite materials such as G-10, FR4 and other materials that are not easily die cut.
Our advantages: ** Professional manufacturer ** CE Compliant product ** Speed adjustable ** Length adjustable ** Imported PLC and cutting blade Features: PCB type:single and double sides PCB or PCBA PCB Size:50~600mm adjustable PCB Materia
Electronics Forum | Wed Mar 10 18:37:27 EST 1999 | Earl Moon
I am looking for a supplier for bare fr4 material. I use the fr4 for fixtures and my supply has run out. A supplier in the new england area would be the best. thank you New England Laminate Co (NELCO) and Polyclad in NH. Earl Moon
Jot Automation J501-57 (2010) Laser Depaneling Cell Brand: Jot Automation Model: J501-57 Year: 2010 Description: Laser Depaneling Cell Standard Features • CO2 laser • Cutting beam from top side • Cutting nozzle moved by upper robot axes •
Industry News | 2014-10-01 15:59:00.0
PCB provider Cirtech Electronics located in Cape Town, South Africa will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid. Bidding for the auction will open promptly at 8:00am PDT on October 7th, 2014 and will begin closing at 6:00am PDT on October 14th, 2014.
Industry News | 2014-10-10 16:27:51.0
CB provider Cirtech Electronics will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid.
PC12P Inventory Material: Copper Clad FR4, Single Sided, 2 oz. Series: - Size Dimension: 18.00" x 12.00" (457.4mm x 304.8mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: Copper Clad, Positive Sensitized PC12P-E RFQ
SMT multifunctional steel net switch frame use for all kind Screen Printing Equipments It’s use for SMT Screen printer machine exchange the steel net, easy exchange , save time and money. Use for size 650*550mm, 580*580mm, 550*650mm,520*420mm,
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2019-09-23 09:35:00.0
Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).
Events Calendar | Fri Aug 28 14:00:00 EDT 2015 - Fri Aug 28 02:30:00 EDT 2015 | New Bedford, USA
Webinar: Flex & Rigid-Flex PCB's - Applications and Cost Drivers
PCB V cut separator for 460mm FR4 and aluminum PCB Sprache English /products/pcb-v-cut-separator/ Español /es/products/pcb-v-cut-separator