Industry Directory | Consultant / Service Provider
Provides strain gage bonding service, calibration and data acquisition service for pc board strain measurement
Industry Directory | Manufacturer
Our mission To help people live active, healthy lives by increasing their access to early diagnosis of osteoporosis. Our purpose Supporting healthy ageing by increasing access to osteoporosis diagnosis. Our vision A world ...
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
New Equipment | Industrial Automation
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Electronics Forum | Thu Apr 25 01:20:58 EDT 2019 | smith88
I am having fractures in my tantalum caps, I believe it is from out fading but I am having a hard time convincing others. Where they are not hermatically sealed are thes fractures a concern? Moisture is entering the body regardless of the fractures?
Electronics Forum | Mon Dec 26 13:24:12 EST 2005 | mariss
I'm assuming the fracture in tension; the fracture doesn't show even at X50. The broken edges are that clean. I would expect spalling at the fracture edges if it were a compression or torsional fracture. This makes me belive the board expands and pul
Industry News | 2011-02-24 20:35:03.0
The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.
Industry News | 2016-10-09 20:43:23.0
The SMTA Capital Chapter is pleased to announce its final meeting of 2016 will be on November 10th, from 5:00 pm to 7:00 pm at Zentech, 6980 Tudsbury Road, Baltimore, Maryland 21244. The focus of this chapter meeting will be “AXI and MXI; How They Complement Each Other” presented by John Travis, Nordson Dage.
Parts & Supplies | ESD Control Supplies
10s 10) Tensile strength: 3.6Mpa 11) Fracture elongation: 188% 12) Tear elongation: 20.6KN/m 13) Rebound elasticity: 14% 14) Impact embrittlement temperature: No damage at -25℃ 15) Permanent compression change rate, 70℃*22h, compression 25%: 17
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Parts & Supplies | Pick and Place/Feeders
Product Description NXT nozzle can be divided into a variety of various models, a variety of styles, a variety of specifications. Commercially available nozzle has: NXT original nozzle, NXT imitation nozzle, NXT three generations nozzl
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
Suitable for diversified glass fibre board, FR-4 board, aluminum board, etc, especially for the PCB with components on both sides. If you have any question about the machine, please feel free to contact e-mial : bella@qy-smt.com
PLG series Computer Control Resonant High Frequency Fatigue Testing Machine Application： Electromagnetic resonance High-frequency fatigue testing machine has simple structure, convenient operation, high efficiency, low energy consumption and othe
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
SMTnet Express, January 27, 2022, Subscribers: 25,985, Companies: 11,506, Users: 27,032 Fracture Toughness Analysis of Epoxy-Recycled Rubber-Based Composite Reinforced with Graphene Nanoplatelets for Structural Applications
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). Introduction The increasing awareness of health risk associated with lead (Pb
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
) Lifted metallization from substrate or package post. (a-7) Fracture of die. (a-8) Fracture of substrate. b. For external bonds connecting device to wiring board or substrate: (b-1
