Panasonic NPM D3A Pick and Place Machine Equipment If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place
electrical and electronics EMC shielding cover and frame for PCB board Fast lead time for prototype and tooling More material in stock
Electronics Forum | Tue Aug 12 14:49:26 EDT 2008 | awegener
I'm attempting to pick and place a small rivet onto our PCB. The rivet should be attached via reflow solder. The rivet will be used to create a sandwich, holding together a frame and additional circuit board in a package. This part is intended onl
Electronics Forum | Tue Apr 27 05:26:14 EDT 1999 | Charles Stringer
Hey MoonMan, Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop!
Industry News | 2014-02-19 16:36:30.0
Europlacer,announces that it will showcase the new Lzero3 in Booth #2472 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
KHY-M221A-A0 COVER DUCT ASSY for YAMAHA YG and YS SMT placement equipment YAMAHA KHY-M221A-A0 COVER,DUCT ASSY. YG12 YS12 KHY-M7AC0-00 SCAN CAM. ASSY KKD-M78C0-00 SCAN CAM. ASSY KHY-M7AC0-000 SCAN CAM. ASSY YG12/YS12 KKD-M78C0-000 SCAN CAM.
Technical Library | 2015-04-23 18:48:18.0
Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
Mx400L has an IPC 9850 speed of 42,000 CPH. It will accomodate a PCB size up to 26.77" x 18.11", it has 6 module heads on the front gantry, 6 module heads on the rear gantry. minimum lead pitch is 15mil, and it will place parts down to 01005 (0402 me
MX200P has a IPC9850 Speed of 15,000CPH. 4 Modular Heads, 1 Precision Head, capable of inspecting and placing parts from 01005's (0402 metric) through 1.96"x 1.96" square, or 3.54" x 1.18" rectangular.Pitch capablity 12 mil, 80 feeder slots. All Mir
Development of Ultra-Multilayer Printed Circuit Board Development of Ultra-Multilayer Printed Circuit Board This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets
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Nordson MARCH Demonstrates FlexTRAK-CD Plasma System for Lead Frame and Strip-type Electronic Components at NEPCON Japan MARCH Products Corporate Global Directory