The SCANFLEX® Board Grabber is a universal tool to hold JTAG/Boundary Scan UUTs and modules. Oscilloscopes, logic analyzers or other instruments can be connected via additional nails probes. The Board Grabber can be used for rapid prototype testing i
GTI-5000 BGA "Surface Mount" PCB Analysis The GTI-5000 Computer Image Processor is designed for the x-ray analysis of surface mount, BGA and PCB components. The software can provide analysis of BGA defects including bridging, voids and missing ball
Electronics Forum | Fri Feb 13 09:36:58 EST 2009 | jlbelectronics
Hi, I have a Versatronics RV1 pacer with 7 feeders and camera system. The camera function seems to have stopped working. The compostite output from the camera is working anf the cable has beend chekced. The PC frame grabber card is manufactured by A
Electronics Forum | Mon Sep 14 07:58:36 EDT 1998 | Earl Moon
Jon: What stimulated this? It's okay to pick on Earl, but explain who is placing .008" pitch. Sounds like the olde hybrid guys? Always looking for cheap equipment to do hi-rel production. Wayne Wayne, I resemble that remark. Jon, That's a
GlenBrooks RTX-113, real time X-ray system X-Ray tube was replaced (apx $7.5k value) 12" Monitor, X-Ray Tube, Power Supply and Controls. Glenbrooks patented XRTV High Sensitivity X-Ray Camera, enhanced with eight frame recrusive averaging. Image
Tektronix TDS420A Four-Channel, 200 MHz Digitizing Oscilloscope The TDS420A Digital Storage Oscilloscope is designed for professionals who demand high precision and fidelity from their measurements. The instrument has a bandwidth of 200MHz, fou
Industry News | 2008-02-28 21:48:17.0
OXFORD, CT � February 2008 � MIRTEC a leading global supplier of AOI systems to the electronics manufacturing industry, announces that it will introduce its MV series of AOI systems in booth 1857 at the upcoming APEX exhibition & conference scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2009-03-16 18:07:28.0
OXFORD, CT � March 2009 � MIRTEC, �The Global Leader in Inspection Technology,� announces that it will introduce the latest advancements to its MV Series of AOI systems as well as unveil the company's first In-Line SPI System, the MIRTEC MS-11, in booth 147 at the upcoming APEX exhibition & conference scheduled to take place March 31- April 2, 2009 in Las Vegas.
SMT multifunctional steel net switch frame use for all kind Screen Printing Equipments It’s use for SMT Screen printer machine exchange the steel net, easy exchange , save time and money. Use for size 650*550mm, 580*580mm, 550*650mm,520*420mm,
SMT MACHINE GENUINE SPARE PARTS JUKI 2050 2060 2070 2080 X LMT SENSOR APM-D3B1-J 40002228 JUKI Pats Specifications: Brand Name JUKI 2050 2060 2070 2080 X LMT SENSOr Part number 40002228 Model APM-D3B1-J Ensure Test in machine confirmation
Technical Library | 1999-08-27 09:27:10.0
Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
and Lead Delamination - Application Note 1086 Acoustic image of a SOIC showing delaminations (red), Diagram of a SOIC. Sample & Method This SOIC, taken from a failed consumer product, was imaged from the top on C-SAM with gating on the die face, lead frame and paddle around the die