New SMT Equipment: ft-ir (25)

Honeywell 80366195-100 HLAI RED COMP EA Honeywell 51204170-100

Honeywell 80366195-100 HLAI RED COMP EA Honeywell 51204170-100

New Equipment | Industrial Automation

Select the right products & services to meet your needs! PLeases contact us mailto:unity@mvme.cn Contact: Sandy Lin  mailto:unity@mvme.cn Skype: live:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Produc

Moore Automation

Honeywell 80366195-125 HLAI FTA COMPR EA Honeywell 51204170-125

Honeywell 80366195-125 HLAI FTA COMPR EA Honeywell 51204170-125

New Equipment | Industrial Automation

Select the right products & services to meet your needs! PLeases contact us mailto:unity@mvme.cn Contact: Sandy Lin  mailto:unity@mvme.cn Skype: live:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Produc

Moore Automation

Electronics Forum: ft-ir (4)

soldermask color change around vias

Electronics Forum | Fri Jun 07 11:19:14 EDT 2019 | gregoryyork

If you have soldered with HASL finish then the worrying chemistry will be more like NON IONIC. They sit there and attract moisture like mad and any chlorides they hold ionize in the moisture attracted and cause electromigration or SIR issues. They ca

Ionic Contamination Acceptance Criteria

Electronics Forum | Tue Dec 14 18:03:22 EST 2004 | Dreamsniper

Hi, Can you guide with the above? I read ROSE Test is a process control tool. What about Ion Chromatography, SIR and FT-IR. What Accpetance Criteria will I use for our assembly when using WS Flux? My WS Flus says it has 0% Halide so What can Ion Chr

Industry News: ft-ir (2)

Cimetrix 300 mm Tool Connectivity Software Continues Market Penetration

Industry News | 2002-05-14 09:21:49.0

Thermo Nicolet Ships FT-IR Metrology Tool Fitted with the Package

Cimetrix, Inc.

STI Features Evaluation and Detection of Counterfeit Components

Industry News | 2008-12-06 02:06:40.0

MADISON, AL � December 2008 � STI Electronics, Inc., a full service organization providing training, distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, provides evaluation and detection of counterfeit components.

STI Electronics

Technical Library: ft-ir (2)

Effect of Silicone Contamination on Assembly Processes

Technical Library | 2013-02-07 17:01:46.0

Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.

Harris Corporation

Contamination Profile of Printed Circuit Board Assemblies in Relation to Soldering Types and Conformal Coating

Technical Library | 2017-12-11 22:31:06.0

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.

Technical University of Denmark

Express Newsletter: ft-ir (2)

Partner Websites: ft-ir (27)

Full List of Heller Reflow Ovens & Equipment Spare Parts - Heller

Heller Industries Inc. | https://hellerindustries.com/browse/page/500/

:   2623K---30 AMP FUSE - USE P/N 5479K for KOREA/CHINA BUILT OVEN 2643---IR Panel old 16X12- Contact Purchasing 2644---IR Panel old 16X9- Contact Purchasing 2645---RESET S/W-(replaced by 586444

Heller Industries Inc.


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