Technical Library: fuji and fuji and ip-2 (Page 1 of 1)

Design and Process Development for the Assembly of 01005 Passive Components

Technical Library | 2018-03-05 11:22:48.0

Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.

Sanmina-SCI

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