FUJI Pick and Place Robot M3 III Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place mach
FUJI M6 III High Speed Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place ma
Electronics Forum | Mon Jan 18 02:49:03 EST 2016 | nirmex
1-Machine speed. 2-New Head H24 and DYNA Head. 3-New Feeder type W08f 4-New Part Camera. 5-New Y-Axis Flat cable design. 6-New GUI with Touch Screen. 7-Panel Height detection. 8-Feeder raising detection. 9-NPI tools support. 10-Overall machi
Industry News | 2013-10-01 04:27:08.0
Fuji Machine Manufacturing Co., Ltd. is proud to announce the release of the DynaHead (HX) and HexaFeeder for our electronic component mounting machines (placing machines). DynaHeads are supported on AIMEX II and AIMEX IIS machines. HexaFeeders are supported on NXT II, NXT III machines as well as AIMEX-series machines.
Industry News | 2011-04-20 21:38:55.0
Both local and international electronics manufacturers are aware of the fact that to miss a NEPCON China event is to forego numerous exciting business opportunities. NEPCON China is a trusted barometer of the state of the electronics manufacturing industry in China and Asia.
Supply & repair below FUJI parts at a lower price: FUJI CP6 FEEDER CALIBRATION JIG FUJI CP6 HIMV 134 CPU FUJI CP6 Z DRIVER SAA1340 DR1B-02AC FUJI CP642(643) SERVO CARD IS70C FUJI CP642(CP643) 4800 VISION CARD FUJI CP643 CAMERA K1133X IK-542F
FUJI nozzles and nozzle holderof Juguangheng company: Fuji NXT H08M 10.0 Nozzle AA8MB06 Fuji NXT H08M 5.0G Nozzle AA8MG05 R19-050G-155-M Fuji NXT H08M 7.0G Nozzle AA8MH05 Fuji NXT H08M 1.8M Nozzle AA8MR04 R19-018M-155-M Fuji NXT H04S 1.0 Nozzle
Technical Library | 2018-03-05 11:22:48.0
Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.
SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia
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FUJI NXT H08M 10.0G NOZZLE - AA8MK07 - QYSMT HOME ABOUT US PRODUCT & SERVICE Panasonic JUKI YAMAHA FUJI SAMSUNG SIEMENS HITACHI