The YS / SS and ZS Feeder Finger Solution is designed to work with Yamaha’s Electronic Feeders to improve the feeders efficiency by significantly reducing production setup and change-over-time. The Feeder Finger coupled with the advantages of the ele
The IPE Feeder Finger Solution is designed to work with the iPulse F3 Electronic Feeders to improve the feeder’s efficiency and significantly reduce feeder setup and change over time. The Feeder Finger coupled with the advantages of the electric moto
Electronics Forum | Thu Mar 30 13:15:17 EST 2006 | gregp
Maybe the issue is how the feeders are being unloaded. The operators should leave enough covertape to reload the reel onto a feeder without component waste. If the issue is some parts are exposed in the feeder then you will most likely loose those p
Electronics Forum | Thu Oct 16 15:09:47 EDT 2003 | Tom B
Hello All, Can anyone tell me a supplier of SMT Leader tape. I remember (but don't know the name) an after market manufacture that sold them in 12" strips with the Adhesive added. I thought they also made Board loders and un-loaders. Or if anyone
WATCH this industry leader out print them all NOW on our website under videos WINNER ! ! This system took the GLOBAL TECHNOLGY AWARD for 2011, presented at the Productronica show in Germany. Than took the Circuit Assembly award at the APEX Show 2
Industry News | 2013-08-20 23:02:16.0
Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.
Industry News | 2011-02-10 12:57:14.0
Essemtec AG announces that the new product video on its Tucano is now available for viewing at www.essemtec.com. The video sequence provides a close-up preview of the small footprint stencil printer in action.
Technical Library | 1999-08-05 09:34:44.0
This document demonstrates a sequential process of evaluating automated wafer instruments and discusses why this approach is useful for studying instruments that have automation features such as loading and focusing mechanisms. The methodology specifies a series of experiments consisting of two or more capability studies followed by a stability study. Each experiment achieves a separate goal, yet combines with the others in providing information needed to assess the usefulness of the instrument.
Career Center | Danao city, Cebu Philippines | Engineering,Maintenance,Production,Quality Control
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