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Electronics Forum | Mon May 10 19:36:08 EDT 2004 | gabriele
Many Tnks Dave, always helpful is your support. I am not familiar how to access EMPF, I have tried already last wk but I was able to read only the abstract of RR0013. Is the access for free or it necessary to be a registered SMTA member ? Regards G
Electronics Forum | Mon May 10 19:44:15 EDT 2004 | davef
Hi Gabriele Has the snow melted up there, yet? No, SMTA membership, while good in its own right, is not a prerequiste to ordering documents from EMPF. Select "order technical publications" here: http://www.empf.org/html/empfset.htm
Industry News | 2012-12-17 19:16:10.0
IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.
Technical Library | 2018-03-07 22:41:05.0
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.
SMTnet Express, March 8, 2018, Subscribers: 31,288, Companies: 10,911, Users: 24,465 Optimization of Stencil Apertures to Compensate for Scooping During Printing Gabriel Briceno, Ph. D., Miguel Sepulveda; Qual-Pro Corporation This study
. Jonathan Arritola, Micro Systems Engineering, Inc. Velu Arunthavarajah, Celestica Inc. Jon Ashton, Universal Instruments Corporation Melanie Atkins, Austin Manufacturing Services Gabriel Avelar, ITWEAE Dinos Avgousti, Ducommun Incorporated William Axler, Addon Technologies Panya Babwa
. Hörfunkstudio im Eingang West Kontakt im Studio (nur während der Öffnungszeiten) Gabriel und Susanne Wirth Tel.: +49 89 949-27000 E-Mail: s tu di o@ me ss er ad io -m ue nc he n