New SMT Equipment: gabriele (1)

Honeywell CC-TDIL01 51308386-175 . Digital Input 24V

Honeywell CC-TDIL01 51308386-175 . Digital Input 24V

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1  Mobile(Whatsapp): (+86)-18020776786 ​​​ Yuehang:  Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply: New+original+factory sealed+high quality

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: gabriele (21)

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Mon May 10 19:36:08 EDT 2004 | gabriele

Many Tnks Dave, always helpful is your support. I am not familiar how to access EMPF, I have tried already last wk but I was able to read only the abstract of RR0013. Is the access for free or it necessary to be a registered SMTA member ? Regards G

Affect of Moisture on Assembled PCBs

Electronics Forum | Tue May 18 17:07:18 EDT 2004 | gabriele

Wave Solder temperature should not cause problem to MSDs. Just in case on PBA there are very critical MSLs (ie. 5 or 5a, 6 (?!?) try to detect what is the max temperature on such MSD bodies and how long they stay under such temperature. But it schoul

Industry News: gabriele (7)

New RSM for the Southwest at Metcal

Industry News | 2016-08-22 19:22:27.0

Metcal today announced that it has hired a new Regional Sales Manager for the Southwest. Gabriel Ortiz will manage Arizona, New Mexico, Texas, Oklahoma, Louisiana, and Mexico and South America.

Metcal

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

Technical Library: gabriele (1)

Optimization of Stencil Apertures to Compensate for Scooping During Printing

Technical Library | 2018-03-07 22:41:05.0

This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.

Qual-Pro Corporation

Express Newsletter: gabriele (1)

SMTnet Express - March 8, 2018

SMTnet Express, March 8, 2018, Subscribers: 31,288, Companies: 10,911, Users: 24,465 Optimization of Stencil Apertures to Compensate for Scooping During Printing Gabriel Briceno, Ph. D., Miguel Sepulveda; Qual-Pro Corporation This study


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