Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Technical Library | 2019-07-11 11:07:08.0
Affordability is not exactly the primary word which comes to mind when discussing the use of design of experiments (DOE) principles, but is generally accepted as a necessary part of the engineering activities required in the development of a product or process. However, a number of studies have indicated that the cost savings derived from a well deliberated experimental design can be substantial in the initial stages where the conditions or parameters of a process are determined. Some studies have shown a greater than 50% cost savings compared to the more conventional means of trial and error approaches to process development. At ACI Technologies (ACI), we have found the use of DOE techniques fundamental in eliminating extraneous costs otherwise spent on unnecessary testing.
Technical Library | 2021-09-02 08:17:07.0
We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com
Technical Library | 2018-11-07 03:31:04.0
Generally speaking, there are not many cases of insufficient solder and solder short in BGA soldering, but it is not impossible. Here we discuss some elements may cause it
Technical Library | 2011-02-17 18:03:21.0
Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas
Technical Library | 2023-10-09 15:18:50.0
This technical document provides necessary information and general guidelines for soldering and PCB design for the Würth Elektronik eiSos MEMS sensor products with an LGA surface-mount package
Technical Library | 2010-10-21 16:01:17.0
Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level of conventional high voltage resistors which are generally availab
Technical Library | 2010-11-06 02:44:38.0
An increasing number of video equipment is running at Gigabit rates today. They are interconnected through relatively large size coaxial BNC connectors. While these connectors are in general of good quality, their performance in the equipment depends on
