Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Technical Library | 2015-04-02 20:12:58.0
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. According to the iNEMI 2013 placement accuracy for these kinds of components will reach 6 sigma placement accuracy in X and Y of 30 um by 2023.This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape. The correlation of deposit diameter and positioning deviation as a function of piezo actuation profile shows that positioning error for deposits increase almost monotonically with decreasing droplet volume irrespective of the piezo-actuation profile. The trends for shape and satellite levels are not as clear and demand further study.
Technical Library | 1999-05-07 09:54:35.0
In this paper, we give an overview of the ASCI Option Red Supercomputer. The motivation for building this supercomputer is presented and the hardware and software views of the machine are described in detail. We also briefly discuss what it is like..
Technical Library | 2007-03-13 15:22:55.0
This article gives an explanation of what e-waste is and states the regulations on how it can be disposed of. It also tells what some companies are doing to help the consumer get rid of it.
Technical Library | 2017-05-31 18:19:44.0
These guidelines give the assembly team a standardized, no-nonsense method to produce a reliable panelization solution. By eliminating panelization guesswork, you ensure successful assembly even for complex projects.
Technical Library | 2010-10-13 17:29:21.0
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So, it is necessary for everyone, who handles electrostatic sensitive devices (ESDS), to know the reasons of such failures. This presentation will give
Technical Library | 2011-11-16 22:11:58.0
Flexible Circuits are proven, reliable interconnect solutions for many of today's electronic packages. This article gives some general guidelines in terms of "dos" and "don'ts" that will help the engineer or designer make better decisions when using flex
Technical Library | 1999-05-09 13:07:16.0
This paper will give the reader a general understanding of EOS and ESD phenomena. It specifically addresses hand soldering's role in EOS and ESD and how to protect against and test for potential problems. It discusses how Metcal Systems address EOS and ESD concerns and how they differ from conventional soldering systems.
Technical Library | 2022-09-08 16:40:50.0
Liquid seals in the automotive industry have to meet high functional quality standards and have to be applied in the shortest possible time in view of the high volume of workpieces. This market environment gives rise to innovations that guarantee maximum speed and quality from initial design to final results.
Technical Library | 1999-05-07 08:04:23.0
Stereolithography is a handy tool not only for speeding a design to market but also in giving customers an early edge. By allowing a form-and-fit sample to be quickly made from a computer model, stereolithography coupled with simultaneous engineering allows customers to see product models early in the design cycle. And if a picture is worth a thousand words, what's a tangible sample worth?
