Panasonic NPM D3A Pick and Place Machine Equipment If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place
Model R50CD (Computer) Heating zones Upper 5/lower 5 Length of heating zone 1730mm PCB width Chain 300mm, mesh 350mm Conveyor chain width range 50-300mm PCB direction L→R or （R→L） Chain fixing Front fix(back fix is optional) Conveyor hei
Electronics Forum | Fri Jul 25 23:01:04 EDT 2008 | chip_flip
What paste are using? You should referance the manufactures time and temperature specification. Running lead-free in a 5 zone oven can be done with out a problem but it is not production friendly. If you are concerned with through put I would look fo
Electronics Forum | Mon Jul 28 11:31:42 EDT 2008 | blnorman
Ideal situation is get a technical rep from the solder paste supplier. They know their paste better, and should be able to work out a profile based on their paste and your oven. Again, a technical rep, not the sales guy.
Industry News | 2012-06-05 08:56:01.0
In collaboration with Stoelting, MB Tech, Koki & Heller Industries, ZESTRON, the global leader in high precision cleaning products and services for the electronics manufacturing industry, and Adtool, their Canadian distributor, are hosting free-of-charge workshops titled ‘Solutions for Resolving Current SMT Industry Challenges’ in Canada.
Industry News | 2019-08-19 22:58:44.0
Seika will showcase a complete line up of leading-edge equipment in Booth #410 at SMTA International. Products includes the latest models from McDry, Sayaka, SAWA, Unitech and MALCOM.
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
Technical Library | 2007-05-31 19:05:55.0
This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder.
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SMTnet Express, January 30, 2014, Subscribers: 26500, Members: Companies: 13561, Users: 35693 Going Lead Free With Vapor Phase Soldering - Lead Free Is Still a Challenge For Major Industries. by Andreas Thumm; IBL-Löttechnik GmbH As of today
SMTnet Express, November 17, 2016, Subscribers: 26,573, Companies: 15,019, Users: 41,420 How Mitigation Techniques Affect Reliability Results for BGAs Greg Caswell, Melissa Keener; DfR Solutions Since 2006 RoHS requirements have required lead free
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BOM SQA LEAD FREE 350X60X15 DEK Squeegee 350mm With Holder And Blade Leave a Message We will call you back soon! Your message must be between 20-3,000 characters