The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certif
10 zone reflow oven with superior water cooling - plenty of cooling for lead free Edge/Mesh combo conveyor Water cooled for superior cooling, chillers available Chain oilers Dual cooling section Left to right transfer Facilit
Configuration ● Water cooled for superior cooling performance (includes chiller) ● edge/mesh conveyance ● left to right transfer ● flux management system ● Pure Forced Convection Heating ● Advanced Windows Operating system with Data Logging.
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2009-04-13 16:22:34.0
DORSET, UNITED KINGDOM - April 2009 - Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it has signed an agreement to distribute Hexi Electronic Equipment Co. Ltd.'s reflow systems.
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2009-09-18 14:42:37.0
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA
SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support
A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, January 30, 2014, Subscribers: 26500, Members: Companies: 13561, Users: 35693 Going Lead Free With Vapor Phase Soldering - Lead Free Is Still a Challenge For Major Industries. by Andreas Thumm; IBL-Löttechnik GmbH As of today
SMTnet Express, November 17, 2016, Subscribers: 26,573, Companies: 15,019, Users: 41,420 How Mitigation Techniques Affect Reliability Results for BGAs Greg Caswell, Melissa Keener; DfR Solutions Since 2006 RoHS requirements have required lead free
Rehm Lead Free Reflow Rehm Reflow Oven Rehm Group Model Number: SMS-V6-N2-B2600/50-460 Serial Number: 0968 Date: 10/2001 Left to Right PCB Flow Mesh Belt with Edge Rail Conveyor Support Nitrogen Capable Lead Free Capable 5 Heating Zones 1 Cooling Zone Computer Controlled CE Marked Dimensions: 232 x 55 x 59 (inches) Weight
! That rate meets even the most demanding lead-free profile requirements! Process Control Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all