Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto
I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal
Electronics Forum | Wed Feb 09 12:28:58 EST 2005 | Valerie
We have been pretty successful with screen printing glue, however the smallest component we now glue is a 0805. We had many problems using our Gemini II to put down glue dots for a 0603, so we altered the pads to do double-side reflow. As our own int
Electronics Forum | Fri Oct 12 09:17:12 EDT 2001 | mikecampbell
Hello, I need some advice. I want to create apertures in my stencil for a IBM CCGA. I've heard the standard is 4800 cubic mils of paste per aperture. I usually use a 5mil stencil for this type of product. There is no way I'll get enough paste wit
Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake
The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon
| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor
Electronics Forum | Thu Feb 15 13:46:16 EST 2018 | aemery
Griinder, Maybe it's me, but I think what you might be saying here is that you see a reflected image of the PCB or Stencil when you and teaching the fiducials and it is interfering with the teaching routine, is that correct? If this is true it is c
Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks
Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
