New SMT Equipment: gmx (81)

WESTINGHOUSE	1C31116G01

WESTINGHOUSE 1C31116G01

New Equipment | Industrial Automation

give me a inquiry, i will get you back immediately or in 9 hours. if you have a large purchase, we can make a discount. Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

WESTINGHOUSE	1C31197G05

WESTINGHOUSE 1C31197G05

New Equipment | Industrial Automation

give me a inquiry, i will get you back immediately or in 9 hours. if you have a large purchase, we can make a discount. Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: gmx (2)

Dross removal

Electronics Forum | Tue May 02 01:42:02 EDT 2006 | ge_lim

Hi Anyone has used Kera-clean Dross Ex to clean the dip soldering nozzle before? This product is from Kera-Technik@gmx.de, GmbH, Germany, and has been quite effective in removing the dross residue on the nozzle. Tell me is there a similiar product

EKRA E4 model Service Manual PDF

Electronics Forum | Sun Oct 07 04:01:58 EDT 2018 | doan

Please sent me an EKRA-E4 manual in PDF, my e-mail: anhdung@gmx.de Thanks

Industry News: gmx (1)

Green Manufacturing Expo Introduced

Industry News | 2007-06-11 18:52:56.0

Los Angeles, CA (June 5, 2007) – Canon Communications LLC, the leading producer of trade events serving the nation's $1 trillion advanced manufacturing

UBM Canon

Technical Library: gmx (1)

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Technical Library | 2020-01-09 00:00:30.0

PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

Polymer Competence Center Leoben GmbH


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