ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/smtai-2015
. RoHS mandated materials and advanced component characteristics can create challenges for conformal coating coverage and adhesion. Nickel-Palladium-Gold leads for instance can be difficult to deposit conformal coating on to, in particular the knees
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-mesoshere-plasma-systems-enable-very-high-throughput-processsing
applied materials, removes excess wafer applied mold /epoxy, enhances adhesion of gold solder bumps, destresses wafer to reduce breakage, improves spun-on film adhesion, and cleans aluminum bond pads. The
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/surface-modification?con=t&page=2
), wafer level packaging (WLP) and micro… AP-1500 Plasma-System - A4 Nordson MARCH Plasma Prior to Conformal Coating Virtually Eliminated PCBA Adhesion Problems Nordson MARCH Bonding Strengths at Plastic Encapsulent
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/wafer-level-packaging
. Plasma cleaning of the wafer surface improves bump adhesion and has been demonstrated to increase bump shear strength dramatically. Bump materials include solder of varying compositions and gold studs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/sphere-wafer-series
excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/industries/medical-life-science-and-pharmaceutical?con=t&page=4
Products Nordson MARCH PROGENY™ system prevents shape deformation from bending or coiling during plasma treatment Surface Preparation for Improved Adhesion Nordson MARCH Bonding Strengths at Plastic Encapsulent
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
problem with the adhesion of the final coating. You don’t mention what type of flux is being used, but this is one place where an aggressive flux can be used to remove the passivation from the nickel coating
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/industries/electronics-semiconductor?con=t&page=11
MARCH Surface Preparation for Improved Adhesion Nordson MARCH Optimization of Ion and Electron Properties in IC Packaging Applications Nordson MARCH Optical Fiber Cladding Removal Nordson MARCH
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/industries/energy?con=t&page=1
−Gold-Plated Copper Leadframe Interface Nordson MARCH Plasma Prior to Conformal Coating Virtually Eliminated PCBA Adhesion Problems Nordson MARCH SMTA Pan Pacific Symposium 2018 Nordson MARCH Nordson MARCH presenting
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/industries/energy?con=t
−Gold-Plated Copper Leadframe Interface Nordson MARCH Plasma Prior to Conformal Coating Virtually Eliminated PCBA Adhesion Problems Nordson MARCH SMTA Pan Pacific Symposium 2018 Nordson MARCH Nordson MARCH presenting
